Announcement of the release of the latest leaflet for the SONOSYS Corporation's megasonic cleaning device.

Leave the latest ultrasonic cleaning to Sonosys.

Ultrasonic Cleaning Spray Nozzle For non-contact single substrate cleaning, we offer a megasonic nozzle with either a single nozzle, dual nozzle, or triple channel, and any combination of frequencies ranging from 600kHz to a maximum of 9MHz. The transducer of this megasonic nozzle generates megasonics and sends them through a fluid (such as pure water) to clean the surface of the substrate. Megasonic Immersion Transducer This is a megasonic immersion transducer with frequencies of 400kHz, 600kHz, 1MHz, and 2MHz. A sealed transducer made of stainless steel or plastic (e.g., PP, PVDF, or PFA) is installed at the bottom or side of an existing tank. In addition to standard systems for substrate sizes of 4", 6", and 8", custom immersion transducers are also available. The highly adaptable configuration allows the megasonic system to be used in bath-tank cleaning processes, improving cost-effectiveness. Frequencies available are 400kHz, 600kHz, 1MHz, and 2MHz.

• CVD Equipment
• CMP Equipment
• Photomask

The Digital Generator is a digital control generator compatible with megasonic cleaning systems for semiconductors, electronic components, and precision instruments.

The Sonosys Digital Generator is a next-generation digital generator developed for megasonic cleaning. It supports a wide frequency range from 400 kHz to 9 MHz, achieving high-precision output control with a maximum of 35W and a minimum of 0.35W. It is equipped with remote monitoring and control functions via Modbus communication, allowing real-time visualization of output, temperature, and operating status. Additionally, it is compatible with existing Sonosys nozzles, promoting smart factory initiatives while keeping equipment upgrade costs down. This innovative solution contributes to quality improvement and digital transformation in semiconductor cleaning, electronic component cleaning, and precision parts cleaning.

• Wafer
• Photomask
• Other semiconductor manufacturing equipment

Next-generation megasonic technology can instantly clear wafers up to 300mm.

The SONOSYS 1MHz megasonic system (FTF transducer & MGH generator) is a high-performance system designed to optimize the cleaning process of single substrates. The main features are as follows: - High-precision cleaning: The PFA-sealed transducer is installed approximately 1.5mm from the substrate, delivering megasonic energy uniformly. - Patent technology: Utilizing "butterfly piezoelectric ceramic" technology, it achieves up to 40% higher sound pressure and up to 30% higher efficiency compared to conventional systems. - Single process compatibility: Suitable for cleaning substrates or wafers up to 300mm. - High output specifications: Features an output adjustment range of 150W (approximately 20% to 100%) and utilizes 1MHz ultrasound. - Stable operating environment: The enclosure is a compact 19-inch design. - Operating temperature range is +10°C to +40°C. - Durability and adaptability: Capable of handling liquid temperatures up to +80°C (when using nitrogen cooling). - PTFE-coated coaxial HF cable (3m) included. - Precision design: Installation distance is approximately 1.5mm (at 1MHz), with a minimum liquid layer thickness of approximately 4mm on the substrate.

• Photomask
• Other semiconductor manufacturing equipment
• Ultrasonic Cleaner

Sonosys's ultrasonic cleaning solves the challenges of wafer cleaning.

In the semiconductor industry, particularly in wafer manufacturing, the removal of fine foreign substances and residues is a critical issue that affects product quality. Even slight contamination on the wafer surface can lead to decreased device performance and lower yields. Sonosys's ultrasonic megasonic cleaning equipment addresses these challenges by achieving high cleaning power and uniform cleaning, contributing to quality improvement in wafer manufacturing. 【Usage Scenarios】 - Removal of foreign substances in the wafer manufacturing process - Cleaning of precision parts - Rinsing process after chemical cleaning 【Benefits of Implementation】 - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield

• Ultrasonic Oscillator
• Ultrasonic Cleaner
• Ultrasonic cleaner

Surface cleaning for MEMS device manufacturing with Sonosys ultrasonic cleaning.

In MEMS device manufacturing, the removal of fine foreign substances and residues is a critical issue that affects product quality. Even slight contamination on the wafer surface can lead to decreased device performance and lower yield. Sonosys's ultrasonic megasonic cleaning equipment addresses these challenges by achieving high cleaning power and uniform cleaning, contributing to quality improvement in MEMS device manufacturing. 【Application Scenarios】 - Removal of foreign substances in the MEMS device manufacturing process - Cleaning of precision parts - Rinse process after chemical cleaning 【Benefits of Implementation】 - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield

• Ultrasonic Oscillator
• Ultrasonic Cleaner
• Ultrasonic cleaner

Sonosys's ultrasonic cleaning solves the challenges of wafer cleaning.

In the semiconductor manufacturing industry, particularly in wafer production, the removal of fine foreign substances and residues is a critical issue that affects product quality. Even slight contamination on the wafer surface can lead to a decline in device performance and a decrease in yield. Sonosys's ultrasonic megasonic cleaning equipment addresses these challenges by achieving high cleaning power and uniform cleaning, thereby contributing to quality improvement in wafer manufacturing. 【Usage Scenarios】 - Removal of foreign substances in the wafer manufacturing process - Cleaning of precision parts - Rinse process after chemical cleaning 【Benefits of Implementation】 - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield

• Ultrasonic Oscillator
• Ultrasonic Cleaner
• Ultrasonic cleaner

Precision cleaning of optical lenses with Sonosys ultrasonic cleaning.

In optical lens manufacturing, the removal of fine foreign substances and residues is a crucial issue that affects product quality. Even slight dirt on the lens surface can lead to a decline in device performance and a deterioration in yield. Sonosys's ultrasonic megasonic cleaning equipment addresses these challenges by achieving high cleaning power and uniform cleaning, contributing to quality improvement in optical lens manufacturing. 【Application Scenarios】 - Removal of foreign substances in the optical lens manufacturing process - Cleaning of precision parts - Rinsing process after chemical cleaning 【Effects of Implementation】 - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield

• Ultrasonic Oscillator
• Ultrasonic Cleaner
• Ultrasonic cleaner

Ultrasonic cleaning by Sonosys for slurry removal in CMP engineering.

In the CMP process, the removal of slurry from the wafer surface is a critical process that affects product quality. Residual slurry on the wafer surface can lead to defects and reduced yield in subsequent processes. Sonosys' ultrasonic megasonic cleaning equipment achieves high cleaning power and uniform cleaning, contributing to quality improvement in the CMP process. [Usage Scenarios] - Slurry removal in the CMP process - Foreign matter removal in the wafer manufacturing process - Rinse process after chemical cleaning [Effects of Implementation] - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield

• Ultrasonic Oscillator
• Ultrasonic Cleaner
• Ultrasonic cleaner

Thorough removal of fine contaminants from wafers. High-quality cleaning achieved by Sonosys.

In the semiconductor industry, particularly in wafer manufacturing, the removal of fine contaminants is a critical issue that affects product quality. Fine particles and organic substances adhering to the wafer surface can lead to decreased device performance and lower yields. Our ultrasonic megasonic cleaning equipment effectively removes these contaminants from the wafer surface using megasonic technology. This supports the production of high-quality semiconductor products. 【Usage Scenarios】 - Cleaning in the wafer manufacturing process - Removal of fine contaminants and organic substances - Production of high-quality semiconductor products 【Benefits of Implementation】 - Improved cleaning quality - Enhanced yield - Increased product reliability

• Ultrasonic Oscillator
• Photomask
• Ultrasonic Cleaner

For precise cleaning of prisms. Sonosys ultrasonic cleaning device.

In the optical industry, precise cleaning that affects the quality of prisms is essential. In particular, the removal of fine dust and oil films can impact light transmittance and refractive index, potentially degrading product performance. Our ultrasonic megasonic cleaning equipment thoroughly removes fine dirt adhered to the surface of prisms using megasonic power, contributing to the production of high-quality products. [Application Scenarios] - Cleaning in the prism manufacturing process - Cleaning of optical lenses - Cleaning of precision parts [Benefits of Implementation] - Improved product quality with high cleaning power - Reduced cleaning time - Lower cleaning costs

• Ultrasonic Oscillator
• Photomask
• Ultrasonic Cleaner

We have newly added a **"Frequently Asked Questions Q&A"** section to the Hyper CLT sheet website. It clearly summarizes many questions frequently asked by those considering the introduction of the product, such as "What types of civil engineering sites can it be used on?", "Can it be used on rainy days?", "Is it compatible with large machinery?", and "What is NETIS?". The Hyper CLT sheet is a lightweight wooden sheet utilizing wood CLT, suitable for a wide range of applications including temporary roads, access routes, and heavy machinery work yards. It is also registered as a **Ministry of Land, Infrastructure, Transport and Tourism NETIS registered technology "TH-250021-A"**. Since it is a new material, we will not leave any uncertainties unaddressed. We aim to create a website that makes it easy to resolve questions before introduction, including information on wood, NETIS, civil engineering, and CLT, and we will continue to enhance the Q&A section.

We have added a new **"Glossary"** to the Hyper CLT sheet website. In the civil engineering and construction industries, there are many specialized terms such as "CLT," "NETIS," "temporary roads," and "wooden lightweight sheets." Therefore, we have introduced related terms in an easy-to-understand manner so that those who are encountering Hyper CLT sheets for the first time can understand the products and technologies. Hyper CLT sheets are wooden lightweight sheets for civil engineering that utilize wood CLT and are registered under the Ministry of Land, Infrastructure, Transport and Tourism's NETIS technology as **"TH-250021-A."** We hope that by not only conveying the features of the product but also sharing the underlying technologies and terminology, users will feel a closer connection to Hyper CLT sheets. We will continue to enhance our website and provide clear information related to wood, NETIS, civil engineering, and CLT.

Hotron Inc. has launched its new product, the "Vehicle Count Sensor CCS3"! This product is a ceiling-mounted sensor that combines infrared and radar technology. It reliably detects vehicles in both directions with a single unit, accommodating traffic during congestion and vehicle passing, thus achieving efficient occupancy management in large parking lots. Additionally, it can be utilized for exit warning purposes in addition to vehicle counting, contributing to the safe and smooth operation of parking facilities. 'Features' - Improved detection performance against changes in road surface during rainy weather by using both infrared and radar. - Equipped with IP67 waterproof and dustproof performance, making it effective even in salt damage areas. - Various settings can be configured from a dedicated app (for Android devices), with current settings easily understandable at a glance. - The base dimensions are the same as the previous model "CCS2," allowing for smooth replacement of existing equipment. *For more details, please refer to the product information, catalog download, or contact us.*

On September 15, 2026, we issued a press release regarding the wooden lightweight sheet "Hyper CLT Sheet." The Hyper CLT Sheet is a civil engineering sheet that utilizes CLT (Cross-Laminated Timber) stacked in an orthogonal direction. It can be used in various locations such as temporary roads, access routes, heavy machinery work yards, and material storage areas. The 5×10 version weighs approximately 230 kg, making it relatively lightweight and easy to install, remove, and relocate. Additionally, it offers environmental benefits such as reducing glare and metallic sounds typical of wood, as well as CO2 fixation. Furthermore, it can be proposed for the use of new technologies in public works as a **registered technology with the Ministry of Land, Infrastructure, Transport and Tourism "TH-250021-A."** Through this press release, we aim to expand the new wooden lightweight sheet that combines wood, NETIS, civil engineering, and CLT to more construction sites.

We have published the latest issue (No. 94) of the ISO-related information magazine "Intertek News." Intertek News delivers information and various topics related to ISO audits, certifications, and verifications. This issue features a special section titled "Interpreting Standard Revisions," which introduces key points of management system standard requirements that new personnel should understand as preparation for standard revisions. Additionally, we have included customer case studies, articles contributed by auditors, and information on certifications and standards, as well as the latest topics, so please take a look.