Sonosys's ultrasonic cleaning solves the challenges of wafer cleaning.
In the semiconductor industry, particularly in wafer manufacturing, the removal of fine foreign substances and residues is a critical issue that affects product quality. Even slight contamination on the wafer surface can lead to decreased device performance and lower yields. Sonosys's ultrasonic megasonic cleaning equipment addresses these challenges by achieving high cleaning power and uniform cleaning, contributing to quality improvement in wafer manufacturing. 【Usage Scenarios】 - Removal of foreign substances in the wafer manufacturing process - Cleaning of precision parts - Rinsing process after chemical cleaning 【Benefits of Implementation】 - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield
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【Features】 ≪Ultra-Precision High-Frequency Megasonic Cleaning Spray Nozzle≫ - Diverse cleaning needs addressed through combinations of single, dual, and triple channel nozzles and frequencies - Megasonic immersion-type transducer operating from 400kHz to 9MHz ≪Ultra-Precision High-Frequency Megasonic Immersion Cleaning System≫ - Stainless steel or plastic transducers - Compatible with 4", 6", and 8" substrate sizes - Improved cost-effectiveness through bath-tank cleaning 【Our Strengths】 Tick Corporation focuses on providing products that meet our customers' needs. With years of experience and a wide range of product offerings, we propose optimal cleaning solutions.
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Single Wafer Cleaning Systems Applications • Non-contact cleaning of single substrates • High-precision particle removal • Megasonic cleaning using pure water as the medium • High-purity cleaning of semiconductor and optical components Examples • Introduced as custom cleaning equipment with single, dual, and triple nozzle configurations to semiconductor manufacturers Megasonic Cleaning Nozzles Applications • Single wafer cleaning • Photomask cleaning • Non-contact cleaning of MEMS and microstructures • Lift-off process • Improved chemical cleaning efficiency in semiconductor front-end processes • Energy-saving in wet bench processes (reduction of chemicals and electricity) Examples • Adopted worldwide as semiconductor front-end cleaning equipment using high-frequency megasonics from 400kHz to 9MHz • Used by MEMS manufacturers as a cleaning solution that minimizes damage to fine micro and nano structures
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Tick Corporation is committed to providing products that contribute to solving various issues faced by companies, such as improving production efficiency, enhancing cost efficiency, improving quality, and considering environmental conservation. We have been widely collecting product information from around the world and providing products that meet market needs. In the future, we will continue to develop and deliver products that contribute to rationalization and particularly to environmental conservation, which has become increasingly stringent in recent years. ◇◆Main Products◇◆ - Precision industrial spray nozzles - Agricultural spray nozzles - Air nozzles / Air knives - Special spray nozzles - Tank cleaning nozzles - Blowers - Ultrasonic spray nozzles (Nebulizers / Atomizers) - Ultrasonic cleaning devices - Air conveying devices - Ventilators - Plastic connectors - Cutting torches (nozzles for gas cutters) - Latex testers - In-house manufactured tubing pumps (dispensers) - Syringe pumps
