[Exhibition Information] SONOSYS from Germany will exhibit at "SEMICON Japan 2026".

Thorough removal of fine contaminants from wafers. High-quality cleaning achieved by Sonosys.

In the semiconductor industry, particularly in wafer manufacturing, the removal of fine contaminants is a critical issue that affects product quality. Fine particles and organic substances adhering to the wafer surface can lead to decreased device performance and lower yields. Our ultrasonic megasonic cleaning equipment effectively removes these contaminants from the wafer surface using megasonic technology. This supports the production of high-quality semiconductor products. 【Usage Scenarios】 - Cleaning in the wafer manufacturing process - Removal of fine contaminants and organic substances - Production of high-quality semiconductor products 【Benefits of Implementation】 - Improved cleaning quality - Enhanced yield - Increased product reliability

• Ultrasonic Oscillator
• Photomask
• Ultrasonic Cleaner

For precise cleaning of prisms. Sonosys ultrasonic cleaning device.

In the optical industry, precise cleaning that affects the quality of prisms is essential. In particular, the removal of fine dust and oil films can impact light transmittance and refractive index, potentially degrading product performance. Our ultrasonic megasonic cleaning equipment thoroughly removes fine dirt adhered to the surface of prisms using megasonic power, contributing to the production of high-quality products. [Application Scenarios] - Cleaning in the prism manufacturing process - Cleaning of optical lenses - Cleaning of precision parts [Benefits of Implementation] - Improved product quality with high cleaning power - Reduced cleaning time - Lower cleaning costs

• Ultrasonic Oscillator
• Photomask
• Ultrasonic Cleaner

Leave the latest ultrasonic cleaning to Sonosys.

Ultrasonic Cleaning Spray Nozzle For non-contact single substrate cleaning, we offer a megasonic nozzle with either a single nozzle, dual nozzle, or triple channel, and any combination of frequencies ranging from 600kHz to a maximum of 9MHz. The transducer of this megasonic nozzle generates megasonics and sends them through a fluid (such as pure water) to clean the surface of the substrate. Megasonic Immersion Transducer This is a megasonic immersion transducer with frequencies of 400kHz, 600kHz, 1MHz, and 2MHz. A sealed transducer made of stainless steel or plastic (e.g., PP, PVDF, or PFA) is installed at the bottom or side of an existing tank. In addition to standard systems for substrate sizes of 4", 6", and 8", custom immersion transducers are also available. The highly adaptable configuration allows the megasonic system to be used in bath-tank cleaning processes, improving cost-effectiveness. Frequencies available are 400kHz, 600kHz, 1MHz, and 2MHz.

• CVD Equipment
• CMP Equipment
• Photomask

Sonosys's ultrasonic cleaning solves the challenges of wafer cleaning.

In the semiconductor industry, particularly in wafer manufacturing, the removal of fine foreign substances and residues is a critical issue that affects product quality. Even slight contamination on the wafer surface can lead to decreased device performance and lower yields. Sonosys's ultrasonic megasonic cleaning equipment addresses these challenges by achieving high cleaning power and uniform cleaning, contributing to quality improvement in wafer manufacturing. 【Usage Scenarios】 - Removal of foreign substances in the wafer manufacturing process - Cleaning of precision parts - Rinsing process after chemical cleaning 【Benefits of Implementation】 - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield

• Ultrasonic Oscillator
• Ultrasonic Cleaner
• Ultrasonic cleaner

Surface cleaning for MEMS device manufacturing with Sonosys ultrasonic cleaning.

In MEMS device manufacturing, the removal of fine foreign substances and residues is a critical issue that affects product quality. Even slight contamination on the wafer surface can lead to decreased device performance and lower yield. Sonosys's ultrasonic megasonic cleaning equipment addresses these challenges by achieving high cleaning power and uniform cleaning, contributing to quality improvement in MEMS device manufacturing. 【Application Scenarios】 - Removal of foreign substances in the MEMS device manufacturing process - Cleaning of precision parts - Rinse process after chemical cleaning 【Benefits of Implementation】 - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield

• Ultrasonic Oscillator
• Ultrasonic Cleaner
• Ultrasonic cleaner

Sonosys's ultrasonic cleaning solves the challenges of wafer cleaning.

In the semiconductor manufacturing industry, particularly in wafer production, the removal of fine foreign substances and residues is a critical issue that affects product quality. Even slight contamination on the wafer surface can lead to a decline in device performance and a decrease in yield. Sonosys's ultrasonic megasonic cleaning equipment addresses these challenges by achieving high cleaning power and uniform cleaning, thereby contributing to quality improvement in wafer manufacturing. 【Usage Scenarios】 - Removal of foreign substances in the wafer manufacturing process - Cleaning of precision parts - Rinse process after chemical cleaning 【Benefits of Implementation】 - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield

• Ultrasonic Oscillator
• Ultrasonic Cleaner
• Ultrasonic cleaner

Precision cleaning of optical lenses with Sonosys ultrasonic cleaning.

In optical lens manufacturing, the removal of fine foreign substances and residues is a crucial issue that affects product quality. Even slight dirt on the lens surface can lead to a decline in device performance and a deterioration in yield. Sonosys's ultrasonic megasonic cleaning equipment addresses these challenges by achieving high cleaning power and uniform cleaning, contributing to quality improvement in optical lens manufacturing. 【Application Scenarios】 - Removal of foreign substances in the optical lens manufacturing process - Cleaning of precision parts - Rinsing process after chemical cleaning 【Effects of Implementation】 - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield

• Ultrasonic Oscillator
• Ultrasonic Cleaner
• Ultrasonic cleaner

Ultrasonic cleaning by Sonosys for slurry removal in CMP engineering.

In the CMP process, the removal of slurry from the wafer surface is a critical process that affects product quality. Residual slurry on the wafer surface can lead to defects and reduced yield in subsequent processes. Sonosys' ultrasonic megasonic cleaning equipment achieves high cleaning power and uniform cleaning, contributing to quality improvement in the CMP process. [Usage Scenarios] - Slurry removal in the CMP process - Foreign matter removal in the wafer manufacturing process - Rinse process after chemical cleaning [Effects of Implementation] - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield

• Ultrasonic Oscillator
• Ultrasonic Cleaner
• Ultrasonic cleaner

Next-generation megasonic technology can instantly clear wafers up to 300mm.

The SONOSYS 1MHz megasonic system (FTF transducer & MGH generator) is a high-performance system designed to optimize the cleaning process of single substrates. The main features are as follows: - High-precision cleaning: The PFA-sealed transducer is installed approximately 1.5mm from the substrate, delivering megasonic energy uniformly. - Patent technology: Utilizing "butterfly piezoelectric ceramic" technology, it achieves up to 40% higher sound pressure and up to 30% higher efficiency compared to conventional systems. - Single process compatibility: Suitable for cleaning substrates or wafers up to 300mm. - High output specifications: Features an output adjustment range of 150W (approximately 20% to 100%) and utilizes 1MHz ultrasound. - Stable operating environment: The enclosure is a compact 19-inch design. - Operating temperature range is +10°C to +40°C. - Durability and adaptability: Capable of handling liquid temperatures up to +80°C (when using nitrogen cooling). - PTFE-coated coaxial HF cable (3m) included. - Precision design: Installation distance is approximately 1.5mm (at 1MHz), with a minimum liquid layer thickness of approximately 4mm on the substrate.

• Photomask
• Other semiconductor manufacturing equipment
• Ultrasonic Cleaner

The Digital Generator is a digital control generator compatible with megasonic cleaning systems for semiconductors, electronic components, and precision instruments.

The Sonosys Digital Generator is a next-generation digital generator developed for megasonic cleaning. It supports a wide frequency range from 400 kHz to 9 MHz, achieving high-precision output control with a maximum of 35W and a minimum of 0.35W. It is equipped with remote monitoring and control functions via Modbus communication, allowing real-time visualization of output, temperature, and operating status. Additionally, it is compatible with existing Sonosys nozzles, promoting smart factory initiatives while keeping equipment upgrade costs down. This innovative solution contributes to quality improvement and digital transformation in semiconductor cleaning, electronic component cleaning, and precision parts cleaning.

• Wafer
• Photomask
• Other semiconductor manufacturing equipment

A collaborative product of Rehila's nozzle technology and Sonosys's ultrasonic technology.

Particles (droplets) formed by the ultrasonic spray nozzle are broken up by the vibrations of the piezo element. In other words, unlike pressurized systems, the particles do not have speed. As a result, they either fall naturally or float due to the influence of the wind. Therefore, carrier air is used to transport the formed particles for application.

• Ultrasonic Oscillator
• nozzle
• Coating Machine

Global Information, in collaboration with the research company PTR, will host a free co-sponsored webinar titled "EV Charging Infrastructure in the Asia-Pacific Region: Challenges of Fast Charging and Power Grid Enhancement." ■ Content A comprehensive explanation of the rapidly evolving electric vehicle charging infrastructure (EVCI) situation in the Asia-Pacific (APAC) region. ■ Language Japanese and English. *The presentation will be conducted in English (with Japanese subtitles). ■ Speakers Speakers: Mustafa Mirza, Head of E-Mobility Research Najd Nasseredin, Commercial Director for EMEA and APAC ■ Agenda *The schedule/content below is subject to change. 1. Introduction 2. EV market situation in Japan 3. Other EV market situations in APAC: South Korea, India, ASEAN 4. EV market situation in China 5. EV charging infrastructure situation in Japan 6. Other EV charging infrastructure situations in APAC: South Korea, India, ASEAN, etc.

[Speaker] Ministry of Defense, Maintenance Planning Bureau, Cyber Maintenance Division, Director Shinpei Ara [Key Lecture Content] From peacetime to emergencies, information and communication infrastructure is the foundation for both the lives of citizens and the activities of the Self-Defense Forces. The Ministry of Defense and the Self-Defense Forces are advancing the construction of a "New Defense Information and Communication Infrastructure (tentative name)" utilizing next-generation information and communication technologies, based on the "Ministry of Defense Next-Generation Information and Communication Strategy," to respond to "new ways of fighting" backed by advanced technologies. Additionally, ensuring cybersecurity for this information and communication infrastructure is essential for the activities of the Self-Defense Forces. The Ministry of Defense and the Self-Defense Forces are working to improve their own cybersecurity while also contributing to the overall strengthening of the country's cybersecurity. In this lecture, I will explain the outline of these initiatives and the direction for the future. [Lecture Items] 1. Security Environment (New Ways of Fighting) 2. Information and Communication 3. Cyber 4. Q&A / Business Card Exchange *The program may change according to the latest situation.

[Lecture Topics] 1. A Review of the Mobile Market in 2026 and Outlook for 2027 Mr. Toshiichi Kita, Senior Partner, Nomura Research Institute, Ltd. 1. What happened in the mobile market in 2026? 2. Changes in the sales agency business 3. Evolution of devices and terminals 4. Expansion of the used and refurbished device market 5. The future of communication infrastructure business/telecommunication business 6. The direction of consumer protection rule revisions 7. The direction of competition rule revisions 8. Outlook for 2027 9. Q&A / Business card exchange 2. The Outlook for 5G Infrastructure Development and Network Sharing in the AI Era - The Significance of Neutral Hosts in Future 5G Infrastructure Development Mr. Daisuke Maeda, Executive Officer, Sharing Design, Inc. 1. The history of mobile communications 2. Traffic growth in the AI era and the digital infrastructure development plan for 2030 and the progress of sharing 3. From passive to active sharing 4. Summary 5. Q&A / Business card exchange

Our company will be exhibiting at the "39th Okinawa Prefectural Pharmacists Association Academic Conference." We sincerely look forward to your visit.

This session is aimed at engineers in the manufacturing industry, focusing on data utilization, and will explain practical approaches to factor exploration and predictive model building using JMP products. Analysis does not yield optimal results in one go; it is important to enhance accuracy through repeated trial and error in data preparation and model building. In particular, the quality of data preparation, such as preprocessing and feature creation, significantly influences the results, and JMP allows for efficient progress while visualizing the process. Using publicly available data for model building, we will introduce a series of processes from preparation, including visualization, preprocessing, and feature creation, to factor exploration through correlation and regression analysis, predictive model building (such as neural networks and random forests), and extraction of important factors, all through trial and error. Program: 1) What to do before the model: Key points of data preparation and trial & error using JMP 2) How to proceed with factor exploration and predictive model building without making it a black box ▼Details & Registration https://www.jmp.com/ja/events/live-webinars/non-series/2026/12-15-factor-exploration