Ultrasonic Powder Sifter for Ceramics
Artec ultrasonic sifter DGS 35kHz, ultrasonic hopper FS 35kHz (Flowsonic)
Improving clogging and agglomeration of ceramic powders! Achieving high-precision classification.
In the ceramics industry, managing the particle size of powders, which affects product quality, is crucial. Especially in the manufacturing of high-precision products, it is essential to prevent contamination and achieve a uniform particle size distribution. Traditional sieving methods are prone to issues such as powder clogging, adhesion, and agglomeration, which can lead to decreased classification efficiency and deterioration of product quality. Our ultrasonic powder sifter addresses these challenges and enables high-precision classification. 【Application Scenarios】 - Classification of ceramic raw materials - Classification of sintering aids - Classification of abrasives 【Benefits of Implementation】 - Suppression of clogging, adhesion, and agglomeration - Improved classification efficiency - Stabilization of product quality - Increased yield
Inquire About This Product
Related Videos
basic information
【Features】 - Achieves dry screening with high mesh sizes such as 20μm openings - Compatible with standard JIS mesh frames from Φ75 to Φ400 using a clamp-type fixture for easy one-touch installation - Measures to prevent surface adhesion, bridging, and rat holes using an ultrasonic hopper, improving discharge capacity - Removal of foreign substances and disintegration through ultrasonic screening at the hopper discharge outlet - Enables coordinated management with electronic scales through quantitative supply transport using ultrasonic vibrations 【Our Strengths】 UC Technology leverages years of experience in ultrasonic technology to provide optimal solutions tailored to our customers' challenges. We have a wide-ranging support system in place, from experimental responses and demo equipment loans to ultrasonic consulting.
Price information
The rental evaluation of the demo unit is usually provided free of charge for two days. If you need to evaluate the demo unit for more than a week, please consult with us. Additionally, feel free to contact us for a quote on the complete set of ultrasonic units.
Delivery Time
Applications/Examples of results
【Purpose】The ultrasonic vibrating sieve, which can be easily attached to areas troubled by powder adhesion, is effective for countermeasures against mesh clogging caused by powder adhesion and handling issues in powder transport environments. It has been adopted in various applications from raw material development to mass production environments, including: ■ Paints ■ Battery materials ■ Metal materials ■ Resin materials ■ Pharmaceutical materials/Food materials ■ Toner ■ Chemical products etc. *For more details, please refer to the PDF document or feel free to contact us. We have been exhibiting every year since 2008. This year's Powder Technology Exhibition will be held in Osaka. We look forward to seeing everyone there. Our sales engineers will be available for consultations at the venue, where we will discuss various applications and case studies. 【Exhibition Information】 ■ Exhibition Name: "International Powder Technology Exhibition Osaka" ■ Venue: Intex Osaka ■ Dates: October 15-17, 2025 ■ Opening Hours: 10:00 AM - 5:00 PM (last day until 4:30 PM)
Line up（4）
| Model number | overview |
|---|---|
| DGS35kHz | Ultrasonic oscillator 35kHz frequency 50W/100W |
| C35-SD8 | Ultrasonic converter (transducer) |
| HF5ｍ | HF cable 5m |
| Clamp band jig | Clamp-type band fixture for various sizes of standard sieves. |
catalog（2）
Download All Catalogs
Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.
