Ultrasonic powder sifter for electronic materials to improve purity.
Artec Ultrasonic Sifter DGS 35kHz, Ultrasonic Hopper FS 35kHz (Flowsonic)
Solving the challenges of powder screening processes! Achieving increased yield and reduced time!
In the electronic materials industry, managing the purity of powders, which affects product quality, is crucial. Contamination can lead to a decline in product performance and reduced yield, making reliable foreign matter removal in the powder sieving process essential. Our ultrasonic powder sieving device addresses issues such as clogging and adhesion, contributing to the efficiency of the powder sieving process. 【Application Scenarios】 - Powder sieving process in electronic materials manufacturing - Classification of fine powders using high-mesh sieves - Prevention of contamination and improvement of product quality 【Benefits of Implementation】 - Time savings through increased efficiency in the powder sieving process - Improved product quality through foreign matter removal - Enhanced yield
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basic information
**Features** - Achieves dry sieving with high mesh sizes such as 20μm opening - One-touch installation compatible with clamp-type fixtures for standard JIS mesh frames from Φ75 to Φ400 - Measures against surface adhesion, bridging, rat holes, and improved discharge capacity using an ultrasonic hopper - Removal of foreign substances and disintegration through ultrasonic sieving at the hopper discharge outlet - Quantitative supply transport with ultrasonic vibration allows for integrated management with electronic scales **Our Strengths** UC Technology has been building a track record in various fields based on ultrasonic technology since 1966. We provide optimal solutions tailored to our customers' challenges and have established a wide-ranging support system from experimental responses to demo equipment loans and consulting.
Price information
The rental evaluation of the demo unit is usually provided free of charge for two days. For evaluations of demo units lasting more than a week, please consult us. Additionally, feel free to contact us for a quote on the complete set of ultrasonic units.
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Applications/Examples of results
【Purpose】The ultrasonic vibrating sieve, which can be easily attached to areas troubled by powder adhesion, is effective for mesh clogging caused by powder adhesion and handling measures in powder transport environments. It has a proven track record from various raw material development to mass production environments, including: ■ Paints ■ Battery materials ■ Metal materials ■ Resin materials ■ Pharmaceutical materials/Food materials ■ Toner ■ Chemical products and more *For more details, please refer to the PDF document or feel free to contact us. We have been exhibiting every year since 2008. This year, the Powder Technology Exhibition will be held in Osaka. We look forward to seeing you all there. Our sales engineers will be available at the venue to discuss various applications and case studies. 【Exhibition Information】 ■ Exhibition Name: "International Powder Technology Exhibition Osaka" ■ Venue: Intex Osaka ■ Dates: October 15-17, 2025 ■ Opening Hours: 10:00 AM - 5:00 PM (last day until 4:30 PM)
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| Model number | overview |
|---|---|
| DGS35kHz | Ultrasonic oscillator 35kHz frequency 50W/100W |
| C35-SD8 | Ultrasonic converter (transducer) |
| HF5ｍ | HF cable 5m |
| Clamp band jig | Clamp-type band fixture for various sizes of standard sieves. |
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Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.
