Flexible substrates with high heat resistance and low loss that support high-speed communication.
In the 5G communication industry, components with excellent high-frequency characteristics are required to achieve high-speed data transmission. It is particularly important to minimize signal transmission loss and ensure stable communication quality. Conventional substrates may face challenges with losses in the high-frequency range. Our high-heat-resistant, low-loss all-LCP flexible substrates utilize low dielectric constant materials to reduce losses of high-frequency signals, contributing to the acceleration of 5G communication. 【Application Scenarios】 - Base stations - High-speed data communication devices - High-frequency circuits 【Benefits of Implementation】 - Stabilization of high-speed data communication - Reduction of signal loss - Improvement of communication quality
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【Features】 - High heat resistance and low outgassing due to adhesive-free structure - Stable properties even in high humidity environments due to low moisture absorption - Suitable for reducing loss of high-frequency signals due to low dielectric constant - Excellent chemical resistance, enduring engine oil and chemicals - Thickness adjustment possible due to material composition, allowing flexible adaptation to applications 【Our Strengths】 Yamashita Material is an electronic circuit board manufacturer engaged in the development, production, and sales of FPC (Flexible Printed Circuit Boards). Our motto is to contribute to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times).
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Applications/Examples of results
- Automotive applications: Wiring, sensors, and ADAS (Advanced Driver Assistance Systems) in the engine room - 5G and communication devices: Antennas, RF modules, and network equipment handling high-frequency signals - Medical devices: Cleanroom equipment utilizing low outgassing properties, wearable medical devices - Aerospace: Satellite and avionics equipment requiring heat and chemical resistance - Industrial equipment: Robots and automation devices leveraging high heat and chemical resistance, various sensor substrates
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Company information
We are committed to contributing to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times) as our motto. FPC can be extremely thin and flexible, allowing it to be used in even the smallest spaces. Therefore, it is utilized in various fields such as smartphones, communication devices, medical equipment, eco-cars like EVs/HVs/FCVs, autonomous driving systems, and VR/AR devices. One of our features is our ability to respond to short delivery times, with the shortest possible delivery being available from the "one-and-a-half-day course." Recently, we developed the "BigElec" FPC, which supports high current. It can be used as a substitute for busbars and harnesses, and we have also obtained a patent for it. We are dedicated to listening sincerely to the needs of our customers and society to develop and create new products, while prioritizing safety and consistently delivering high-quality products. This integrated approach strengthens our foundation for growth and maximizes corporate value. We are building a solid foothold in the ever-changing global market and are striving for continuous growth and development. Please feel free to consult with us.
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