Flexible substrate that contributes to power saving of IoT devices with high heat resistance and low loss.
In the IoT device industry, there is a demand for miniaturization while simultaneously extending battery life. Particularly in devices that operate in high-temperature environments or use high-frequency signals, the performance of the substrate significantly impacts the overall power efficiency of the device. Conventional substrates have sometimes hindered power saving due to issues with high-frequency signal loss and heat resistance. Our high-heat-resistant, low-loss flexible substrate contributes to the power efficiency of IoT devices with its low-loss characteristics and high heat resistance. 【Usage Scenarios】 - Wearable devices - Smart sensors - Industrial IoT equipment 【Benefits of Implementation】 - Extended battery life - Miniaturization of devices - Stable transmission of high-frequency signals
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**Features** - High heat resistance and low outgassing due to adhesive-free structure - Stable properties even in high humidity environments due to low moisture absorption - Suitable for reducing loss of high-frequency signals due to low dielectric constant - Excellent chemical resistance, capable of withstanding engine oil and chemicals - Thickness adjustment possible due to material composition, allowing flexible application **Our Strengths** Yamashita Material is an electronic substrate manufacturer engaged in the development, production, and sales of FPCs. We can accommodate short delivery times. Please feel free to consult with us.
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Applications/Examples of results
- Automotive applications: Wiring, sensors, and ADAS (Advanced Driver Assistance Systems) in the engine room - 5G and communication devices: Antennas, RF modules, and network equipment handling high-frequency signals - Medical devices: Cleanroom equipment utilizing low outgassing properties, wearable medical devices - Aerospace: Satellite and avionics equipment requiring heat and chemical resistance - Industrial equipment: Robots and automation devices leveraging high heat and chemical resistance, various sensor substrates
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We are committed to contributing to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times) as our motto. FPC can be extremely thin and flexible, allowing it to be used in even the smallest spaces. Therefore, it is utilized in various fields such as smartphones, communication devices, medical equipment, eco-cars like EVs/HVs/FCVs, autonomous driving systems, and VR/AR devices. One of our features is our ability to respond to short delivery times, with the shortest possible delivery being available from the "one-and-a-half-day course." Recently, we developed the "BigElec" FPC, which supports high current. It can be used as a substitute for busbars and harnesses, and we have also obtained a patent for it. We are dedicated to listening sincerely to the needs of our customers and society to develop and create new products, while prioritizing safety and consistently delivering high-quality products. This integrated approach strengthens our foundation for growth and maximizes corporate value. We are building a solid foothold in the ever-changing global market and are striving for continuous growth and development. Please feel free to consult with us.
![[In Development] GND Slit Structure Flexible Circuit Board](https://image.mono.ipros.com/public/product/image/f49/2001077731/IPROS79423087762742399024.jpeg?w=280&h=280)
