Battery Lamination Foil and TAB Busbar Electrode Joining Machine for EVs
Ultrasonic Metal Welding Machine USDB-AGM 35kHz/20kHz Type
A high-speed, high-quality ultrasonic metal joining machine that accelerates EV battery manufacturing.
In the EV industry, there is a demand for improved battery performance and manufacturing efficiency. In particular, high-quality and stable bonding in the electrode joints, which significantly affect battery performance, is essential. Poor bonding can lead to decreased battery performance and shortened lifespan. Our ultrasonic metal bonding machine achieves high-speed, stable, and high-quality bonding of battery stack foils (over 100 sheets) and TAB bus bar electrodes, addressing challenges in EV battery manufacturing. 【Application Scenarios】 - EV battery pack manufacturing - Secondary battery manufacturing - Bonding of electrodes for EVs 【Benefits of Implementation】 - Improved battery performance through high-quality bonding - Increased productivity through high-speed bonding - Streamlined quality control through data acquisition via Ethernet/IP
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basic information
**Features** - High-speed precision load control (original program) servo press adopted - Pressurization without air bumping or overshoot (constant pressure control) - FEM-analyzed horizontal vibration horn and high-rigidity rigid housing - Unique ultrasonic control method (Rinco ultrasonic oscillation control) equipped with AGM oscillator - Data communication via Ethernet/IP, compatible with automatic machine customization **Our Strengths** UC Technology has been leading ultrasonic technology since 1966, providing ultrasonic solutions necessary for EV battery manufacturing. We support customers from tool proposal and production to experimental response.
Price information
For ultrasonic metal joining machines, ultrasonic tools (horns) and fixtures that are optimal for the customer's work are essential. Since all of these are specially designed products, pricing will be provided upon request. Regarding the main metal joining device, the optimal frequency (20kHz or 35kHz) will be selected based on the work size and joining application. Therefore, we will also respond to inquiries about the price of the main device on a case-by-case basis, so please feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Joining laminated TAB electrodes of aluminum foil, copper foil, and nickel foil for secondary batteries and capacitors ■ Joining flat wire for motor coils and aluminum terminals ■ High-pressure cable connections between copper or aluminum wire conductors and terminals ■ Joining dissimilar metal high-pressure power lines made of copper or aluminum plates ■ Joining lead terminals to power modules and DBC substrates ■ Joining of non-ferrous metals, etc. *For more details, please refer to the PDF materials or feel free to contact us.
Line up（2）
| Model number | overview |
|---|---|
| USDB-AGM20kHz-3600W | This device uses ultrasonic vibrations and load to perform tasks such as wire harness, metal foil, and metal terminal bonding. It is a precision high-speed servo press device that emphasizes high rigidity and high load-bearing capacity through a rigid mechanism, enabling high-speed operation. This device has a judgment function based on thresholds for the parameters of load, ultrasonic oscillation, and time. It is capable of graphing the load, ultrasonic oscillation, and motor position for each processing operation. |
| USDB-AGM35kHz-900W | This device uses ultrasonic vibrations and pressure to perform tasks such as wire harness, metal foil, and metal terminal bonding. It is equipped with a 35kHz ultrasonic oscillator manufactured by RINOC. The device emphasizes high rigidity and high load capacity through a rigid mechanism and employs a precision high-speed servo press that enables high-speed operation. Each parameter, including load, ultrasonic, and time, can be controlled individually. The device can graph the processing results for each operation and transfer them to a PC. |
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Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.
