HiTech Resin Products Corner Bond for Automotive Lightweighting
McDermid Performance Solutions Japan Co., Ltd.
Contributes to vehicle weight reduction through reinforcement of joints in BGA, CSP, and flip chip.
In the automotive industry, reducing vehicle weight is a crucial challenge for improving fuel efficiency and minimizing environmental impact. As electronic components become smaller and more densely integrated, ensuring the reliability of joints is essential. This is particularly important for automotive electronic components exposed to vibrations and temperature changes, as the protection of joints significantly affects product lifespan. HiTech's resin product, Corner Bond, reinforces solder joints of BGA, CSP, and flip-chip components, enhancing reliability and contributing to the durability of lightweight vehicle bodies. 【Application Scenarios】 - In-vehicle ECU - In-vehicle displays - Various sensors - Body control units 【Benefits of Implementation】 - Extension of product lifespan through joint protection - Improvement in fuel efficiency due to weight reduction - Enhanced quality through high reliability
Inquire About This Product
basic information
**Features** - Reinforcement of joints by applying to the edges and corners of BGA - One-component type, medium temperature range, fast thermal curing - Lineup of underfill, corner bond, and potting compounds - Excellent resistance to thermal cycling **Our Strengths** We handle a diverse range of semiconductors and electronic components, supporting our customers' product development. With extensive knowledge of MacDermid's HiTech resin products and a consistent support system from prototyping to mass production and after-sales service, we contribute to solving our customers' challenges.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（7）
Download All Catalogs
Company information
The development of electronics has given people great dreams and has turned those dreams into reality, one by one. This development has been passed on to the 21st century, inspiring even greater dreams and hopes. I am deeply grateful and delighted to have been able to engage in work that contributes to this segment of the electronics industry. Moving forward, I will continue to serve as a conduit for the appropriate information on semiconductors and electronic components, so that I can help realize humanity's great dreams and support the product and information development of our clients. I am committed to walking alongside our clients and growing together in the information society of the 21st century. However, on the other hand, global environmental issues have become increasingly prominent. As a member of society, I feel the importance of leaving a rich natural environment for the future and preserving the fundamental value of humanity. I am determined to strive towards becoming a company that harmonizes with nature and society as we move towards an endless future.
![[Information] Silicone and Polyurethane Materials](https://image.mono.ipros.com/public/product/image/2001173729/IPROS14095406244641426160.png?w=280&h=280)
