Stealth Dicing Laser Processing Machine for Solar Cells

Accelerating the efficiency of solar cell manufacturing! Improving yield with high-quality, high-precision laser processing.

In the solar cell industry, there is a demand for both high performance and cost reduction. In particular, improving the yield of materials and reducing processing time are critical challenges in the manufacturing of solar cell cells. Conventional blade cutting methods are prone to fine cracks and chipping, which can lead to decreased yield. The stealth dicing laser processing machine is equipped with Hamamatsu Photonics' patented stealth dicing engine, enabling high-precision dicing of transparent materials. This contributes to improved yield and stabilized quality. Additionally, high-speed processing through laser irradiation allows for a reduction in production takt time. 【Application Scenarios】 - Cutting processing of solar cell cells - Yield improvement through high-precision dicing - Processing of hard materials such as SiC and sapphire 【Effects of Implementation】 - Improved yield - Increased productivity - Stable supply of high-quality products

Laser marker