Epoxy film for stretchable FPC | Excellent metal adhesion and resilience

Achieves both reflow heat resistance and flexibility. Provides high adhesion to copper foil and silver paste, contributing to the insulation layer of wearable devices and three-dimensional substrates.

This product is an insulating film that combines the "flexibility" and "process resistance" required for stretchable FPC and printable electronics. ■ High adhesion to metals and conductive inks In addition to being capable of copper foil attachment and etching processes, it adheres strongly to silver paste without surface treatment. This enables improved reliability of stretchable circuits, which was difficult with conventional materials. ■ Excellent recovery and heat resistance It has low hysteresis loss and demonstrates excellent recovery even when repeatedly stretched. Additionally, it possesses high heat resistance, capable of withstanding a reflow process at 260 degrees for 5 minutes, which is a significant feature that allows for direct application in electronic component mounting processes. ■ Enhanced design flexibility Despite being a thin film, it ensures an insulation breakdown voltage of 12kV/0.1mm (Type E) and maintains insulation performance. It can be utilized in areas where space-saving and reduced driving load are required, such as smartphone camera modules and the bending sections of foldable devices. *For more details, please download the catalog or feel free to contact us.

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