Rubel Disk Master S220 for Semiconductors

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last updated：Apr 08, 2026

ランテクノロジー

Improving yield with easy operation! For deburring in semiconductor manufacturing.

In the semiconductor industry, the removal of fine burrs and foreign substances during the manufacturing process greatly affects yield. Residues and spatter from laser processing not only degrade product quality but also lead to the occurrence of defective products. The Rubel Disc Master S220 addresses these challenges by providing powerful burr removal capabilities in a compact design. It performs laser residue and spatter removal along with edge rounding in a single pass, contributing to improved yield. 【Application Scenarios】 - Burr removal for semiconductor wafers and substrates - Burr removal for fine parts after laser processing - Processes aimed at improving yield 【Benefits of Implementation】 - Increased efficiency of the burr removal process - Improved product quality - Reduced defect rate

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【Features】 - Compatible with extremely small sizes - Completes laser dross and spatter removal along with edge rounding in one pass - Overwhelming deburring power and uniformity - Simple structure and low cost - Capable of handling burring products and oxide film removal 【Our Strengths】 Lantechnology Co., Ltd. is engaged in the maintenance and sales of laser processing machines. Our experienced staff supports your machinery, and with our unique system management, we respond quickly even in emergencies. We can visit anywhere in the country.