Thin-film process enables the realization of fine and high-precision ceramic wiring boards.
This is a ceramic wiring substrate capable of forming fine patterns through a thin film process. 【Features】 By combining our plating technology, it is also possible to create circuits with different thicknesses on the front and back. Example: Front Cu/Ni/Au, Back Ti/Pt/Au *For more details, please refer to the PDF document or feel free to contact us.
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basic information
■Material: Aluminum Nitride 170, 200, 250W (m·K) ■Conductor Metals: Ti ・ Pt ・ Au *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Located in Chino City, Nagano Prefecture, we are a printed circuit board manufacturer that offers services from design to implementation on circuit boards, from prototype development products to mass production. We have extensive experience in thermal management boards and can propose the most suitable materials and structures for our customers' applications. Additionally, in recent years, we have also been accommodating thick copper boards for high current applications with various substrates.
