New Generation Laser Depaneling

basic information

Non-contact laser processing reduces stress, dust, and burrs, ensuring beautiful cutting quality. High-speed processing enhances productivity and significantly reduces running costs without the need for consumable parts. It is suitable for the division processing of various substrates such as PCBs, FPCs, and ultra-thin substrates, making it ideal for electronics mass production lines.

Price range

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Applications/Examples of results

■ Representative Implementation Cases (3 Major Core Data) 1. Medical Device Sector (Japan, Kansai) - Challenge: Frequent cracks and dust generation in FPC substrate division, increased post-cleaning labor - Effect: Stress-free, dust-free processing | No post-cleaning required | 65% annual cost reduction 2. Automotive Electronics Sector (Germany, Bavaria) - Challenge: Low mass production capability of large PCBs for ADAS, high risk of component detachment - Effect: 30% reduction in processing time | Defect rate below 0.3% | Complete integration with Industry 4.0 3. Communication Equipment Sector (China, Shenzhen) - Challenge: Carbonization and interlayer delamination of 5G substrates, difficulty in fine processing - Effect: Minimal HAZ | ±25μm high-precision processing | 1/3 reduction in running costs ■ Common Implementation Benefits ✅ Clean: Zero dust, burrs, and carbonization | No post-processing required ✅ High Efficiency: Supports large formats + high-speed processing | Productivity increase of up to 40% ✅ Low Cost: Zero consumable parts | Significant reduction in maintenance labor PSG InnoLas DP10X0 | Optimal for diverse substrate division