AAEON, for embedded systems, compatible with 14th/13th/12th generation Core i & Core series 2, capable of mounting MXM GPU modules.
【AAEON MEX-BTS Features】 ■ Width 295 × Height 50 × Depth 186 mm, 2.74 liters ■ Supports 14th/13th/12th generation Core i & Core series 2 CPUs ■ Memory DDR5 5200, up to 64GB ■ 4 COM / 4 USB3.2 + 2 USB2.0 / 5 2.5GbE + 1 GbE ■ HDMI x 1 (HDMI 4K Display) ■ Supports MXM GPU module ■ Expansion slots ・M.2 2280 M-Key x 2 (1 PCIe 4.0 [x4] + 1 PCIe 3.0 [x4]) ・M.2 3052 B-Key x 1 (PCIe 3.0 [x2] + USB3.2 + USB2.0) ・Full-size Mini Card x 1 (PCIe 3.0 [x1] + USB2.0)
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basic information
Specifications ■CPU/Chipset: Socket LGA1700, 14th/13th/12th generation Core i & Core series 2 @ 65W TDP / R680E/Q670E ■Memory: DDR5-5200 SODIMM x 2, maximum 64GB ■I/O Connectors: 2.5GbE x 5, 10/100/1000Base-TX x 1 (RJ-45), USB3.2 (Gen2) x 4, USB2.0 x 2, RS-232 x 2, RS-232/422/485 x 2, 16Bit GPIO x 1, HDMI x 1, DP x 2 (optional, for MXM GPU module), Audio Line in, Line out, Mic in ■Input Power: DC input 19V–24V ■Operating Temperature: 0–50℃ (with airflow) ■Certification: CE/FCC Class A ■OS: Windows 11/Ubuntu 24.04 Kernel 6.11
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Price range
P3
Delivery Time
P4
Applications/Examples of results
For machine, factory, and building automation/monitoring systems.
Line up(3)
| Model number | overview |
|---|---|
| MEX-BTS-A10-0001 | Socket LGA1700, compatible with 14th/13th/12th generation Core i & Core series 2 CPUs, R680E chipset. |
| MEX-BTS-A10-0002 | Socket LGA1700, compatible with 14th/13th/12th generation Core i & Core series 2 CPUs, Q670E chipset. |
| Option | AC adapter (400W), 2.5G Dual LAN, FPC, MXM Type B. NVIDIA RTX 5000/A4500/3500 GPU |
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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.











