Adopts double-sided guide rails and special hardening treatment! Sturdy and durable, reusable, and cost-saving.
The "REIX-4010N" is a reflow oven characterized by high heating efficiency and low power consumption, featuring a high-output motor combined with a large impeller. Advanced insulation technology and a completely new furnace structure design effectively lower the surface temperature of the furnace and reduce heat loss. Under the same conditions, it minimizes the difference in heat absorption between large and small components, achieving an appropriate thermal balance. 【Features】 ■ Achieves high efficiency and uniform heating, energy-saving specifications ■ Insulation structure that reduces heat loss ■ Stable temperature management through high-precision PLC control ■ Durable design that reduces maintenance load and running costs ■ Advanced data functions compatible with temperature monitoring and MES integration *For more details, please download the PDF or feel free to contact us.
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【Device Overview】 ■ Device Dimensions: L6400 x W1580 x H1650 mm ■ Weight: 2500 to 2700 kg ■ Flux Recovery System: Standard ■ Coating Color: White or Hiroki Tech Color *For more details, please download the PDF or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."
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