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  6. Reliability evaluation and failure analysis of joints through power cycle testing.

Reliability evaluation and failure analysis of joints through power cycle testing.

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last updated:May 21, 2026

アイテス
アイテス
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We conduct contract testing using Siemens testing equipment! We can also handle the production of various necessary jigs.

We would like to introduce our "Reliability Evaluation and Failure Analysis of Joints through Power Cycle Testing." We can evaluate the joint reliability of various components of power semiconductors and confirm what kind of abnormalities are occurring in defective parts. We can also handle the production of various jigs necessary for testing. Please feel free to contact us when needed. 【Overview of PWT2400A Equipment (Partial)】 ■ Equipped with 4 heating power supplies of 600A each ■ Equipped with 16 gate power supplies ranging from -10V to 20V ■ Capable of testing up to 16 channels of devices simultaneously ■ Compatible with water-cooled modules *For more details, please download the PDF or feel free to contact us.

    Contract AnalysisContract Analysis
EMS

Reliability evaluation and failure analysis of joints through power cycle testing.

EMS analysis of power cycle tests.png
EMS analysis of power cycle tests.png
  • Related Link - https://www.ites.co.jp/
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【Overview of Other PWT2400A Devices】 ■ Tj measurement using a method compliant with JESD51-14 ■ Automatic transient thermal resistance measurement during testing ■ Standard equipment for TO package fixtures *For more details, please download the PDF or feel free to contact us.

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Reliability evaluation and failure analysis of joints through power cycle testing.

Reliability evaluation and failure analysis of joints through power cycle testing.

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Total solution service for power devices

Total solution service for power devices

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Aites Device List

Aites Device List

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Introduction to Reliability Assurance Services

Introduction to Reliability Assurance Services

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Failure analysis of power devices

Failure analysis of power devices

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Cross beam FIB cross-sectional observation

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Power cycle testing and characteristic evaluation

Power cycle testing and characteristic evaluation

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OBIRCH analysis of SiC devices using short-wavelength lasers.

OBIRCH analysis of SiC devices using short-wavelength lasers.

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Backside light emission analysis of SiC devices

Backside light emission analysis of SiC devices

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Power semiconductor analysis service

Power semiconductor analysis service

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Back surface polishing of semiconductors for luminescence analysis.

Back surface polishing of semiconductors for luminescence analysis.

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【Equipment】FIB (Focused Ion Beam)

【Equipment】FIB (Focused Ion Beam)

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Announcement of the Introduction of FIB-SEM Helios 5 UC

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アイテス

アイテス

Electronic Components and Semiconductors

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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