Contributes to the stabilization of the wafer protection process. Quality improvement through bubble-free bonding.
In the semiconductor industry, particularly in the wafer protection process, the inclusion of fine bubbles can affect product reliability. Manual application and jig application, which depend on the skill level of the operator, carry risks of quality variation and reduced yield. In response to these challenges, our tabletop bonding device 'Lamico' consistently controls the process from adhesive application to bonding, achieving stable bonding with reduced bubbles even with transparent adhesives. 【Usage Scenarios】 - Bonding of wafer protective films - Evaluation of small quantities of various prototypes - Processes requiring precise bonding 【Benefits of Implementation】 - Reduction of quality variation caused by operators - Decrease in defects due to bubble inclusion - Standardization of processes and improvement of yield ＼For more details, please contact us or view the PDF materials available for download in the catalog.／
Inquire About This Product
basic information
【Features】 - Consistent control from adhesive application to bonding - Bubble-free bonding even with transparent adhesives - High reproducibility of adhesive quality independent of the operator - Reduction of quality variation in manual and jig bonding processes - Capable of handling small quantities, diverse products, evaluation processes, and precision bonding 【Our Strengths】 We provide products that contribute to solving customer challenges through the manufacturing and sales of power supply equipment, semiconductor devices, and precision mechanical components. Leveraging the strengths of our five business units, we engage in "proposal-based product development" that values communication with our customers. We not only meet customer demands but also provide new satisfaction with high added value.
Price range
P5
Delivery Time
Applications/Examples of results
For more details, please download the PDF or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Our company manufactures and sells power supply equipment, semiconductor devices, precision mechanical components, system equipment, and synthetic resin coatings. Leveraging our strengths through a five-business structure consisting of precision mechanical components, coatings, power supply devices, bonding/coating equipment, and power semiconductors, we engage in "proposal-based product development" that values communication with our customers. Additionally, through consulting and dialogue during the development process, we not only meet the functions requested by our customers but also provide new satisfaction with added value.
