Contributes to the stabilization of sensor placement quality. Ensures stable adhesive quality for everyone.
In the field of robotics, particularly in sensor placement, precise and uniform adhesion directly impacts the performance and reliability of the product. Manual application and jig application, which depend on the skill level of the operator, are prone to air bubble inclusion and quality variation, potentially leading to sensor malfunctions or failures. To address these challenges and achieve stable sensor placement, our tabletop bonding device 'Lamico' has been developed. [Usage Scenarios] - Mounting sensors on robotic arms - Bonding sensors for autonomous driving systems - Precise placement of sensors for inspection devices [Benefits of Implementation] - Stabilization of quality in the sensor placement process - Reduction of defects due to air bubble inclusion - Decrease in quality variation caused by operators
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basic information
【Features】 - Consistent control from adhesive application to bonding - Ability to bond with transparent adhesives while minimizing bubbles - High reproducibility of adhesive quality independent of the operator - Reduction of quality variation in manual and jig bonding processes - Support for small quantities, diverse products, evaluation processes, and precision bonding 【Our Strengths】 We leverage the technical expertise cultivated through the manufacturing and sales of power equipment, semiconductor devices, and precision mechanical components to provide products that contribute to solving our customers' challenges. Based on the know-how developed in the precision mechanical components business, we engage in high-value product development through dialogue with our customers.
Price range
P5
Delivery Time
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Company information
Our company manufactures and sells power supply equipment, semiconductor devices, precision mechanical components, system equipment, and synthetic resin coatings. Leveraging our strengths through a five-business structure consisting of precision mechanical components, coatings, power supply devices, bonding/coating equipment, and power semiconductors, we engage in "proposal-based product development" that values communication with our customers. Additionally, through consulting and dialogue during the development process, we not only meet the functions requested by our customers but also provide new satisfaction with added value.
