Resinization of HMI, HUD, and clusters, reduction of component count [heat dissipation, EMC]

Integration of components in HMI, meter clusters, HUD, and CID for process shortening and weight reduction. Achieving complex shapes with large housings. Reduction of EMC countermeasure materials.

In recent years, advanced electronic integration of in-vehicle HMI, meter clusters, HUDs, and CIDs has progressed. As a result, the complexity of housings has increased, and necessary functions are being addressed through combinations of numerous components. By implementing thermal management and electromagnetic wave countermeasures with resin, we achieve process shortening and component reduction through material integration. By converting metal components, such as aluminum, which are primarily used as main materials, into resin, weight reduction is possible (approximately 45% down for the same shape). There are also expectations for cost reduction through the freedom of shape provided by resin molding and mass production. While many resin products are inferior to metals in terms of heat dissipation and electromagnetic wave (noise) control, Sekisui Techno Molding's resin products ensure these functions. ■ Thermal conductive resin molded products (focused on heat dissipation) - Reduction of product temperature rise through heat diffusion - Weight reduction, improved design flexibility, and mass production by replacing metal products ■ Heat dissipation and electromagnetic wave shielding resin molded products (balancing heat dissipation and electromagnetic wave shielding) - Reduction of product temperature rise through heat diffusion - Electromagnetic wave shielding performance through conductivity enhancement - Weight reduction, improved design flexibility, and mass production by replacing metal products

plastic