Heat dissipation and electromagnetic wave countermeasures for resin parts in automotive HMI.
- Heat-conducting resin molded products - Heat dissipation and electromagnetic wave shielding resin molded products
Heat dissipation and electromagnetic wave countermeasures in HMI
In recent years, the advanced electronicization of in-vehicle HMIs has been progressing. As a result, measures against heat and electromagnetic waves, which were previously unnecessary, are now required. By switching from conventional general-purpose resins to heat dissipation and electromagnetic wave countermeasure resins, it is possible to address these issues with resin without significant changes to processes or designs. While many heat dissipation resins compromise moldability in exchange for performance, our resin, developed primarily from polypropylene, achieves usability that is not significantly different from general-purpose resins. We provide it as a material that can be utilized with existing molding equipment. ■ Heat-conductive resin molded products (focused on heat dissipation) - Reduction of product temperature rise due to heat diffusion - Lightweighting through substitution of metal products, improved design flexibility, and mass production ■ Heat dissipation and electromagnetic wave shielding resin molded products (balancing heat dissipation and electromagnetic wave shielding) - Reduction of product temperature rise due to heat diffusion - Electromagnetic wave shielding performance through the addition of conductivity - Lightweighting through substitution of metal products, improved design flexibility, and mass production
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basic information
■Heat Conductive Resin Molding Products - Achieving high thermal diffusion in the horizontal (plane) direction ⇒ Thermal conductivity: 26 W/(m·K) - Achieving high rigidity (compared to general-purpose PP resin) ⇒ Bending strength: 52 MPa ■Heat Dissipation and Electromagnetic Wave Shielding Resin Molding Products - Achieving high thermal diffusion in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) - Achieving electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω
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Applications/Examples of results
■Vehicle-mounted camera housing ■Millimeter-wave radar housing ■Meter cluster ■Heat dissipation fins ■Inverter cover, DC-DC converter cover ■OBC case ■e-Axle ■ADAS components ■AD components ■Shield plate ■Others, ECU case
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Company information
Since its establishment, Sekisui Techno Molding has primarily focused on injection molding, supplying products to various industries, including the automotive sector. With the principles of "customer-oriented," "quality-focused," and "environmentally conscious," we aim for manufacturing that is aware of the trends of the times. We are also committed to further evolving our core molding technology and focusing on the development of high-performance resin products, civil engineering materials, and environmentally friendly products. We aspire to be a company that contributes to society.
