Solve the problem of heat during soldering damaging the substrate and limiting the number of reworks!
We would like to introduce a case study conducted by JMT Corporation, where we replaced solder mounting with a socket structure to improve maintainability. Previously, the boards were mounted using solder, and the heat generated during soldering posed a significant problem by damaging the boards. The number of reworks was also limited, and there was a need to pay attention to smoothness. When we proposed replacing it with a socket structure, we received feedback that maintenance time was reduced, which ultimately led to cost savings. 【Case Overview】 ■Challenges - Damage to the boards during solder mounting - Heat from soldering damages the boards and limits the number of reworks - Need to pay attention to smoothness - Previous specification: boards mounted with solder ■Result: Improved maintainability *For more details, please feel free to contact us.
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JMT Corporation is a company that handles PCR (rubber sheets), pressure conductive sheets for semiconductor package inspection, and jigs & pressure conductive sheets for printed circuit board inspection. We will provide high-performance test contactors by integrating our long-cultivated plating technology, photolithography technology, laser technology, and PCR technology. Please feel free to contact us if you have any inquiries.
