[Free Support] Resolving Probe Contact Issues in Power Device Power-On Testing

Poor contact causes sparks. There is a risk of damaging expensive devices?! We will provide free support from identifying the cause of poor contact to selecting probes.

In power device conduction tests, do you have concerns such as, "The contact resistance varies, and the reliability of the data cannot be ensured" or "No improvement even after replacing the probes multiple times"? The causes of contact failure in conduction tests include a variety of factors, such as: - Mismatch between the probe tip shape and the work material - Wear of the probe tip - Adhesion of foreign substances - Deformation of the spring due to high temperatures leading to reduced load and identifying these issues is not easy. Especially in conduction tests that carry large currents, contact failures can lead to abnormal heating or sparking during conduction, potentially resulting in significant losses such as damage to expensive devices or equipment failures. Therefore, we collect your workpieces and the probes you are currently using and conduct experiments on contact resistance and other factors using our own equipment. We visualize the data to identify the root causes of contact failures. Based on this, we propose the optimal probe shape and load conditions tailored to your usage conditions and work characteristics, and we provide free support all the way to the selection that leads to actual improvements. Please feel free to consult us through the inquiry form.

probe