Predicting and solving product behavior during demolding in resin molding! By identifying the causes of demolding defects and taking preventive measures, we can reduce design changes and renovation costs.
This is the "ASU/V-Struct Release Analysis Edition," customized specifically for release analysis during resin injection molding. It is software designed to identify the causes of release defects during injection molding and implement preventive measures in advance, thereby improving the quality of molded products and reducing the costs associated with mold design changes and modifications. - It enables the prediction of sticking and cavity capture in advance, identifying areas that will be captured by the cavity based on displacement distribution and nodal force distribution. - It allows for the prediction of whitening and warping due to protrusion arrangement balance, identifying areas of deformation in molded products based on the evaluation of protrusion loads for each protrusion. - It can accommodate inclined cores (upward and downward) and diagonal movement of slide units. - It enables high-precision predictions that carry over the temperature distribution during injection molding (using ASU/MOLD).
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The ASU/V-Struct, which serves as the basis for the Deformation Analysis Edition, is a high-performance thermal-elastoplastic structural analysis program developed based on V-Struct through the VCAD system research program at the RIKEN Institute. It features a thermal stress-thermal conduction coupled analysis solver that takes into account contact between deformable bodies, contact heat transfer, and the application of pressure to the processed material. This allows for the simulation of deformation and residual stress in molded products due to heat in manufacturing processes such as hot pressing, casting solidification, and resin injection molding cooling processes, where temperature changes need to be considered. It can also be applied to other scenarios such as mold deflection, tightening, vacuum forming, and adhesion analysis. Applicability: To address various challenges in manufacturing processes, we have generously incorporated our CAE element technologies, including contact analysis (for rigid and deformable bodies), heat transfer, contact heat transfer, and surface pressure boundaries! Usability: We provide a dedicated pre-post GUI. Even those unfamiliar with analysis can use it easily without resistance. It includes a built-in mesher, allowing analysis to start directly from design CAD data.
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[Applicable Fields] ■Automobiles ■Aircraft ■Home Appliances ■Office Automation ■Medical Devices ■Low Voltage ■Railways ■Shipbuilding ■Optics etc.
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1. Diversification and Advancement As a cutting-edge comprehensive testing machine manufacturer that meets the diverse needs of all customers, we are committed to connecting to the 21st century. 2. Responsibility and Duty We are dedicated to maintaining our position as the mother tool of the industry and coexisting with our customers. 3. Harmony and Coexistence We strive for harmony with our employees, the community, and society, aiming to be a "good corporate citizen."
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