Intel Core Ultra Series 3 equipped with 3.5” Plus SBC – 3I160DW
The 3.5" Plus (146 × 150mm) size SBC equipped with the Intel Core Ultra Series 3 (Panther Lake) features enhanced graphics performance with a powerful iGPU and a dedicated NPU to accelerate edge AI processing. Designed for high-performance computing, the 3I160DW supports up to 64GB of DDR5 memory through two SO-DIMM slots. It offers a variety of display outputs including dual HDMI, LVDS/eDP, and USB Type-C (DP Alt Mode). Additionally, it is equipped with Intel 2.5G LAN ×2, four serial ports, and three MIPI-CSI interfaces, making it suitable for advanced imaging applications. The expansion options are also very flexible, featuring PCIe x2/x4, a Nano SIM slot, and multiple M.2 interfaces (for storage, wireless, and 5G support). With a wide DC input range and robust design, the 3I160DW is an ideal solution for use in harsh environments such as industrial automation, smart factories, transportation, and healthcare.
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basic information
Main features: - Intel Core Ultra 300 series (Panther Lake) processor - Enhanced iGPU and integrated NPU - DDR5 SO-DIMM ×2, up to 64GB - Multi-independent display support: HDMI ×2, LVDS/eDP, USB Type-C (DP Alt Mode) - Network I/O: Intel 2.5GbE LAN ×5, USB 3.2 Gen1 ×3, USB 2.0 ×5 - Expansion slots: M.2 M Key ×1, M.2 B Key ×2, Nano SIM ×1, PCIe x2 ×1, PCIe x4 ×2 - Other interfaces: COM ports ×4, digital I/O (4DI/4DO), MIPI-CSI ×3, HD Audio - Security and control: TPM 2.0, SMBus, I2C, I2S
Price information
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Delivery Time
Applications/Examples of results
Industrial automation, smart factory, transportation sector, healthcare
Detailed information
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3I160DW Equipped BOX PC - HAWK-3I160DW
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Company information
Our company is a specialized trading company that deals with various embedded products such as edge AI, industrial computers, single-board computers (SBCs), and image capture boards. We handle embedded systems equipped with the latest Intel CPUs (such as Intel Elkhart Lake Atom, Tiger Lake, and Raptor Lake), which are essential for building FA, IoT, and AI edge systems.
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