Cost-effective conductive filler that achieves high-reliability bonding.
In the semiconductor industry, high-reliability bonding requires stability in electrical and thermal connections, as well as long-term performance maintenance. Particularly in miniaturized semiconductor devices, even slight connection failures can impact overall reliability. Therefore, it is crucial to select materials that achieve excellent conductivity and low migration, while also offering superior cost performance. The TOYAL TecFiller TFM series addresses these challenges by combining silver plating technology with inexpensive core materials, achieving both cost reduction and low migration, thereby contributing to the realization of high-reliability bonding. [Usage Scenarios] - As a filler for conductive inks and conductive adhesives - Bonding materials in semiconductor packaging [Benefits of Implementation] - Contributes to product cost reduction - Achieves reliable bonding - Reduces migration
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basic information
【Features】 - High conductivity performance due to uniform silver plating on individual particles - Option to select copper powder or silica powder as core material - Offers spherical and flake particle shapes - Achieves significant cost-effectiveness compared to conventional silver fillers due to the effects of core material price and specific gravity - Contributes to low migration 【Our Strengths】 Toyo Aluminum K.K. has been pursuing the potential of aluminum for functional and aesthetic applications since its establishment, developing useful products. Based on research and development that leverages the characteristics of aluminum, we have contributed to fields such as packaging and electronics by accurately responding to customer needs. By utilizing our unique core technology and global business development, we will meet customer demands and contribute to the advancement of a new society.
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Applications/Examples of results
〇Applications - Conductive ink - Fillers for conductive adhesives applications
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![[Supplementary Material] Regarding the Cost Effectiveness of the TFM-S Series](https://image.mono.ipros.com/public/catalog/image/01/909/798294/IPROS17447797987730950009.jpeg?w=120&h=170)
Company information
Toyo Aluminum K.K. has been pursuing the potential of aluminum's functionality and design since its founding, developing useful products and contributing to society. By accurately responding to customer needs based on the characteristics of aluminum and research outcomes, we produce foil products tailored to applications in packaging, electronics, and daily necessities, as well as powder and paste products as high-performance materials, and solar cell-related products that consider the global environment. We have grown into a manufacturer that operates globally, not only in Japan but also in Europe, the Americas, China, and other Asian countries. Moving forward, we will leverage our unique core technology as a source of development strength, under the action policy of "Creating the future, I create, we all create," to meet customer demands and contribute to the development of a new society.
