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  6. CameraLink Area Camera Series for Semiconductor Manufacturing

CameraLink Area Camera Series for Semiconductor Manufacturing

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last updated:Jul 24, 2026

Japan Bopixel Co., Ltd.
Japan Bopixel Co., Ltd.
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Support for defect detection in semiconductor manufacturing with high-reliability CameraLink.

In the semiconductor manufacturing industry, as miniaturization and high integration progress, there is a demand for accurately detecting minute defects to ensure product quality. In particular, with the acceleration of manufacturing lines, high-resolution and high-frame-rate image acquisition has become essential. To avoid overlooking even slight defects and prevent the outflow of defective products, a reliable image inspection system is crucial. The CameraLink area scan camera series achieves high image quality, high sensitivity, and high fps by combining a simple and highly reliable CameraLink interface with SONY Pregius 2nd Gen CMOS sensors, meeting the precise defect detection needs in semiconductor manufacturing. 【Application Scenarios】 - Wafer inspection - Chip appearance inspection - Printed circuit board inspection 【Benefits of Implementation】 - Improved detection accuracy of minute defects - Accelerated inspection processes - Enhanced production yield

    Color camera
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CameraLink Area Camera Series for Semiconductor Manufacturing

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CL_220x220.png
  • Related Link - https://bopixel.co.jp/cameralink/
  • Special site - Product/service details - https://pr.mono.ipros.com/bopixel/product/

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basic information

**Features** - Lineup of resolutions: 3.2M/5M/8.9M/12.3M, with options for monochrome/color - High sensitivity and low noise image acquisition using SONY's Pregius 2nd Gen - Distortion-free image acquisition with global shutter - Stable image capture at high pixel counts and high fps - Flexibility in installation with mounting taps on the top and bottom surfaces **Our Strengths** - Low power consumption and low heat generation design using next-generation key devices (Ultra Low Power FPGA) - Compact design that balances heat dissipation and mass production capabilities - Electrical design that maximizes the performance of various sensors - Cost competitiveness driven by the purchasing power of our parent company BOPIXEL - Advanced manufacturing that ensures delicate and highly reliable quality according to Japanese standards

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Applications/Examples of results

【Applications】 ■ Front-end appearance inspection of semiconductors ■ Back-end appearance inspection of semiconductors ■ Final appearance inspection of semiconductor components ■ Appearance inspection of assembled boards ■ Various alignments *For more details, please refer to the PDF document or feel free to contact us. We also offer demo units for loan.

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Model number overview
BC-SM3MCL 3.2M (IMX252), mono, 216.2fps, C-mount, PoCL, SDR connector x2
BC-SC3MCL 3.2M (IMX252), color, 216.2fps, C-mount, PoCL, SDR connector x2
BC-SM5MCL 5M (IMX250), mono, 161.9fps, C-mount, PoCL, 2x SDR connectors
BC-SC5MCL 5M (IMX250), color, 161.9fps, C-mount, PoCL, SDR connector x2
BC-SM9MCL 8.9M (IMX255), mono, 91.47fps, C-mount, PoCL, SDR connector x2
BC-SC9MCL 8.9M (IMX255), color, 91.47fps, C-mount, PoCL, SDR connector x2
BC-SM12MCL 12.3M (IMX253), mono, 66.6fps, C-mount, PoCL, SDR connector x2
BC-SC12MCL 12.3M (IMX253), color, 66.6fps, C-mount, PoCL, SDR connector x2

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Machine Vision Camera Comprehensive Catalog 2025

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Company information

Japan

Japan Bopixel Co., Ltd.

Industrial Electrical Equipment

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We focus on the design, development, manufacturing, and sales of high-speed, high-resolution, and highly reliable machine vision cameras primarily using CoaXPress and CameraLink. In addition to developing standard products, we also offer development and customization tailored to customer requests. All camera design and development is carried out by our Japanese staff, ensuring design and production techniques that guarantee delicate and highly reliable standards in Japan, while integrating the dynamic action and speed of China to provide competitive products. At Japan Bopixel, we have successfully become the first camera manufacturer to utilize Ultra Low Power FPGA instead of the standard FPGA adopted by the majority of camera manufacturers. This Ultra Low Power FPGA reduces power consumption by over 50% compared to similar class FPGAs, significantly lowering power consumption and heat generation in cameras by addressing the heat source at its root. By actively adopting these next-generation key devices, we are taking a new approach to the heat generation issues that have traditionally been a challenge.

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