65MP camera contributing to the acceleration and high precision of fine inspection.
＼Equipped with Gpixel's CMOS sensor GMAX3265／ In the semiconductor manufacturing industry, fine inspection requires high resolution to ensure product quality and reliability, as well as fast imaging to enhance production efficiency. Particularly in the inspection of semiconductor devices, where miniaturization is advancing, precise image data that does not overlook even slight abnormalities and a rapid inspection process are essential. Our 65MP CoaXPress area camera has been developed to meet these demands. 【Application Scenarios】 - Surface inspection of semiconductor wafers - Detection of defects in fine circuit patterns - Precise appearance inspection of mounted components 【Benefits of Implementation】 - Reduction of defective products due to improved inspection accuracy - Increased productivity through shortened inspection times - Improved yield through early detection of fine abnormalities
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basic information
【Features】 - Equipped with Gpixel's CMOS sensor GMAX3265 - 50 million pixels high resolution - Up to 71fps (CXP-12×4Lane output) - Ultra Low Power FPGA (low power consumption FPGA) with one of the smallest form factors in the industry - No need for cooling fans or heat sinks due to low heat generation and fanless design - CXP-6×4 lane model (70mm square) / CXP-12×4 lane model (80mm square) available for selection based on application
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Semiconductor front-end/back-end visual inspection, final visual inspection of semiconductor components, visual inspection of assembled boards, various alignments, and industrial image processing focused on semiconductors and electronics.
Line up（8）
| Model number | overview |
|---|---|
| BC-GM65M6X4H | 65MP / mono / 35.5fps / CXP-6 / F/M42 mount / DIN connector / straight model |
| BC-GC65M6X4H | 65MP / color / 35.5fps / CXP-6 / F/M42 mount / DIN connector / straight model |
| BC-GM65M6X4H-AN | 65MP / mono / 35.5fps / CXP-6 / F/M42 mount / DIN connector / angle model |
| BC-GC65M6X4H-AN | 65MP / color / 35.5fps / CXP-6 / F/M42 mount / DIN connector / angle model |
| BC-GM65M12X4 | 65MP / mono / 71fps / CXP-12 / F/M42 mount / MicroBNC connector / straight model |
| BC-GC65M12X4 | 65MP / color / 71fps / CXP-12 / F/M42 mount / MicroBNC connector / straight model |
| BC-GM65M12X4-AN | 65MP / mono / 71fps / CXP-12 / F/M42 mount / MicroBNC connector / angle model |
| BC-GC65M12X4-AN | 65MP / color / 71fps / CXP-12 / F/M42 mount / MicroBNC connector / angle model |
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Company information
We focus on the design, development, manufacturing, and sales of high-speed, high-resolution, and highly reliable machine vision cameras primarily using CoaXPress and CameraLink. In addition to developing standard products, we also offer development and customization tailored to customer requests. All camera design and development is carried out by our Japanese staff, ensuring design and production techniques that guarantee delicate and highly reliable standards in Japan, while integrating the dynamic action and speed of China to provide competitive products. At Japan Bopixel, we have successfully become the first camera manufacturer to utilize Ultra Low Power FPGA instead of the standard FPGA adopted by the majority of camera manufacturers. This Ultra Low Power FPGA reduces power consumption by over 50% compared to similar class FPGAs, significantly lowering power consumption and heat generation in cameras by addressing the heat source at its root. By actively adopting these next-generation key devices, we are taking a new approach to the heat generation issues that have traditionally been a challenge.
