High-precision ceramics for electronics

Micro-hole ceramics with a minimum aperture of φ0.02mm and dimensional accuracy of ±5%.

In the electronics industry, as performance increases, heat dissipation measures from components are becoming increasingly important. Particularly in electronic devices that are becoming smaller and more densely packed, efficient heat dissipation design is directly linked to the reliability and lifespan of the products. Our fine-pore ceramics, through our unique extrusion molding technology, achieve fine pores and deep holes with high dimensional accuracy that are difficult to achieve with conventional processing methods, contributing to the construction of effective heat dissipation pathways. [Application Scenarios] - Heat dissipation materials for electronic components - Cooling system parts - Structural components for devices under high thermal loads [Benefits of Implementation] - Suppression of temperature rise in components - Improved product reliability - Adaptation to miniaturization and high density

Ceramics