Ideal for ceramics and glass! Provides conductivity and heat dissipation with aluminum layer formation!
In the semiconductor industry, there is a demand for high conductivity and heat dissipation due to the miniaturization and high density of components. Particularly in the formation of electrodes on ceramic substrates, the adhesion between materials and stability during firing are crucial. Conventional methods have sometimes struggled to address these challenges. Our aluminum paste demonstrates excellent adhesion to ceramic and glass substrates and contributes to solving these issues by forming a highly conductive and heat-dissipating aluminum layer through firing and sintering. 【Usage Scenarios】 - Formation of external electrodes on ceramic substrates - Formation of heat dissipation paths - Formation of conductive layers in electronic component packages 【Benefits of Implementation】 - Improved electrical performance due to excellent conductivity - Suppression of temperature rise in components due to high heat dissipation - Increased design flexibility due to adhesion to various substrates - Cost reduction by being free of gold and silver
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basic information
【Features】 ◆ Adheres to everything from ceramics, glass, and metal to MMD/CMC. ◆ Can be easily applied using screen printing, dip coating, etc. ◆ Can be fired and sintered in the atmosphere. ◆ Lead and silver-free, making it friendly to both human health and costs. 【Our Strengths】 Toyo Aluminum K.K. has been pursuing the potential of aluminum for functional and design applications since its establishment, developing useful products. By leveraging the characteristics of aluminum and responding to customer needs based on research results, we provide products tailored to fields such as packaging and electronics. With our unique core technology, we meet customer demands and contribute to the development of a new society.
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Formation of electrodes on ceramics, etc.
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Company information
Toyo Aluminum K.K. has been pursuing the potential of aluminum's functionality and design since its founding, developing useful products and contributing to society. By accurately responding to customer needs based on the characteristics of aluminum and research outcomes, we produce foil products tailored to applications in packaging, electronics, and daily necessities, as well as powder and paste products as high-performance materials, and solar cell-related products that consider the global environment. We have grown into a manufacturer that operates globally, not only in Japan but also in Europe, the Americas, China, and other Asian countries. Moving forward, we will leverage our unique core technology as a source of development strength, under the action policy of "Creating the future, I create, we all create," to meet customer demands and contribute to the development of a new society.
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