A diamond heat spreader that efficiently cools only the hotspots. Contributes to improved device performance and reliability.
The Diamond Heat Spreader "TDMC CVD Diamond Insert" quickly disperses heat from the heat source due to its high thermal conductivity of up to 2,000 W/m·K, efficiently cooling only the hotspots that significantly contribute to performance degradation and shortened lifespan, thereby enhancing device performance and reliability. It can be easily integrated into various packages such as QFN, BGA, and SiP, allowing for implementation with minimal design changes to the overall system. We also offer CVD diamond inserts tailored to your design and OEM-compatible thermal management solutions. 【Features】 ■ High thermal conductivity of up to 2,000 W/m·K ■ Thermal management leveraging the unique high thermal conductivity of diamond ■ Contributes to longer device lifespan and performance maintenance ■ Easily integrated into various packages such as QFN, BGA, and SiP *You can view the introduction materials for TDMC's diamond materials from the download button below. Please feel free to contact us regarding this product.
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basic information
We will propose suitable heat dissipation solutions from the design stage under a non-disclosure agreement (NDA). If you are considering high-performance thermal measures, please feel free to contact us.
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You can view the introduction materials for TDMC's diamond materials by clicking the download button below. Please feel free to contact us with any inquiries about this product.
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Company information
Our company is located in Ikuno Ward, Osaka City, and is engaged in the manufacturing and processing of flat glass and mirror products. For many years, we have focused particularly on thin flat glass and thin mirror products. We have operational bases not only in the United States, Taiwan, and China but also in Vietnam and Thailand, allowing us to assist you with procurement and sales from overseas. Please feel free to contact us if you have any requests.