Thermal sheet processing for the telecommunications industry
Heat dissipation sheet punching processing proposed by Olympic Packing Co., Ltd.
Heat dissipation sheet processing to solve thermal issues of base stations.
In the telecommunications industry, particularly in base stations, the increase in heat generation due to enhanced performance has become a significant challenge for the stable operation of equipment. Inadequate thermal management can lead to performance degradation or failure of the equipment. Our thermal dissipation sheet processing addresses these thermal issues with a one-stop solution, from material selection to shape processing and mass production supply, contributing to the improvement of equipment reliability. 【Usage Scenarios】 - Cooling of heat-generating components such as CPUs, GPUs, and power supply units in base station equipment - Stable operation of equipment in harsh outdoor environments - Optimization of thermal design due to miniaturization and high density of equipment 【Benefits of Implementation】 - Achieving stable operation by preventing equipment overheating - Reducing failure risks and maintenance costs - Extending equipment lifespan and improving reliability
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【Features】 - Optimal material selection for heat dissipation sheets based on heat generation and environment - Precision processing such as square and irregular shapes, holes, and notches tailored to the mounting location - A flexible supply system capable of roll supply from prototyping to mass production - Proposals considering thermal conductivity, thickness, hardness, electrical insulation, and environmental resistance - Various processing options including adhesive processing, lamination, and half-cutting 【Our Strengths】 Gorin Packing specializes in the punching of soft materials, realizing our customers' "desired shapes" with reliable technology. We support manufacturing from various angles, including material selection and prototyping proposals during the design phase, a system capable of handling small to large production runs, and processing accuracy that considers ease of handling on-site. As a trusted partner for our customers, we continue to engage in careful manufacturing.
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■CPU・GPU: Heat transfer between high-heat components and heat sinks ■GPU peripheral VRAM/HBM: Gap measures between multiple memory and heat sinks ■VRM・MOSFET and other power circuits: Heat dissipation and insulation measures for power circuit components ■SSD and storage peripherals: Heat measures for controllers and NAND, etc. ■Power supply unit and power semiconductors: Heat dissipation measures for high-heat and high-voltage components ■Back of the circuit board, casing, and backplate: Heat transfer and insulation measures to the casing We propose specifications that are processed into shapes suitable for installation locations, such as rectangular, irregular shapes, holes, cutouts, with tabs, and considering assembly and mass production.
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Since our establishment, we have been providing and proposing rapid and accurate packing technologies, regardless of industry or sector. By swiftly strengthening the establishment of a platform revenue base and accommodating various advanced technologies, we have achieved remarkable development. Utilizing indispensable packing technologies, which are often hidden parts of products, we will continue to strive with all our employees to enhance your satisfaction as our motto.
