Processing of heat dissipation sheets for automotive ECU cooling.
Heat dissipation sheet punching processing proposed by Olympic Packing Co., Ltd.
We propose heat dissipation sheet processing suitable for the thermal challenges of automotive ECUs.
In the automotive industry, the increasing performance of in-vehicle ECUs has led to the challenge of increased heat generation. Since ECUs are essential for vehicle control, thermal management to maintain stable operation is crucial. Thermal interface materials fill the tiny gaps between heat-generating components and heat sinks, efficiently transferring heat to suppress temperature rise in ECUs and contribute to reliability. Our company provides a one-stop solution, from selecting thermal interface materials tailored to customer needs to shaping them according to the installation locations, supporting the resolution of thermal issues in in-vehicle ECUs. 【Application Scenarios】 - Cooling of heat-generating components inside in-vehicle ECUs (such as CPUs and memory) - Efficient heat conduction in limited spaces - Response to vibrations and temperature changes 【Benefits of Implementation】 - Improved stable operation and reliability of ECUs - Extended product lifespan - Optimization of thermal design
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【Features】 - Selection of suitable thermal conductive sheets based on application and heat generation conditions (considering thermal conductivity, thickness, hardness/compressibility, electrical insulation, environmental resistance, etc.) - Precision shape processing tailored to component shapes and assembly processes (square and irregular cutting, holes and notches, multiple parts, tabbed processing, etc.) - Support for adhesive processing, lamination, and half-cutting - Flexible supply forms that accommodate everything from prototypes to mass production, including roll supply - Years of experience and know-how in punching soft materials 【Our Strengths】 Gorin Packing specializes in punching soft materials, realizing our customers' "desired shapes" with reliable technology. We support manufacturing from various angles, including material selection and prototype proposals during the design phase, a system capable of handling small lots to mass production, and processing accuracy that considers ease of handling on-site. We will continue to provide careful manufacturing as a trusted partner for our customers.
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■CPU・GPU: Heat transfer between high-heat components and heat sinks ■GPU peripheral VRAM/HBM: Measures for gaps between multiple memory and heat sinks ■VRM・MOSFET and other power circuits: Heat dissipation and insulation measures for power circuit components ■SSD and storage peripherals: Heat measures for controllers and NAND, etc. ■Power supply unit and power semiconductors: Heat dissipation measures for high-heat and high-voltage components ■Back of the substrate, casing, and back plate: Heat transfer and insulation measures to the casing We propose specifications that are processed into shapes suitable for the mounting locations, such as rectangular, irregular shapes, holes, notches, with tabs, and considering assembly and mass production.
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Since our establishment, we have been providing and proposing rapid and accurate packing technologies, regardless of industry or sector. By swiftly strengthening the establishment of a platform revenue base and accommodating various advanced technologies, we have achieved remarkable development. Utilizing indispensable packing technologies, which are often hidden parts of products, we will continue to strive with all our employees to enhance your satisfaction as our motto.
