Heat dissipation sheet processing for medical devices
Punching processing of heat dissipation sheets proposed by Olympic Packing Co., Ltd.
Processing of heat dissipation sheets to solve thermal issues in imaging diagnostic devices.
In medical devices, particularly imaging diagnostic equipment, temperature management of heat-generating components due to increased performance is directly linked to the stable operation of the device and diagnostic accuracy. Thermal interface materials (TIM), which effectively fill the fine gaps between heat-generating components such as CPUs and GPUs and cooling mechanisms (like heat sinks), are essential for maintaining the reliability of the equipment. Inadequate thermal management increases the risk of device overheating, performance degradation, and ultimately misdiagnosis. At Gorin Packing, we provide consistent support from selecting the optimal thermal interface material, considering factors such as the heat generation of your device, gaps, and usage environment, to precise shape processing tailored to the installation locations. 【Application Scenarios】 - Cooling of heat-generating areas such as CPUs, GPUs, and power units within imaging diagnostic equipment - Optimization of thermal design due to miniaturization and high-density mounting of devices - Ensuring stable operation and longevity of the equipment 【Benefits of Implementation】 - Stable operation of the device by suppressing temperature rise of heat-generating components - Maintenance and improvement of diagnostic accuracy - Enhanced reliability of the device and reduced maintenance costs
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【Features】 - Selection of optimal thermal sheets based on application and heat generation conditions (considering thermal conductivity, thickness, hardness/compressibility, electrical insulation, environmental resistance, etc.) - Precise shape processing tailored to component shapes and assembly processes (rectangular and irregular punching, holes and notches, multiple parts processing, tabbed processing, adhesive processing and lamination, half-cutting, etc.) - Flexible supply forms that accommodate everything from prototypes to mass production, including roll supply - A wide range of proposals tailored to heat generation locations (CPU, GPU, VRAM/HBM, VRM/MOSFET, SSD, power supply units, circuit boards, enclosures, etc.) - One-stop support from material selection to shape processing and supply 【Our Strengths】 Gorin Packing is a company that realizes customers' "desired shapes" with reliable technology, primarily focusing on the punching processing of soft materials. We support development by assisting designers with material selection and prototype proposals, and we aid procurement with a system that can handle stable sourcing from small lots to mass production. For manufacturing, we contribute to improved assembly efficiency on-site with processing precision that emphasizes ease of handling. As a dependable partner supporting our customers' manufacturing, we continue to engage in careful craftsmanship.
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■CPU・GPU: Heat transfer between high-heat components and heat sinks ■GPU peripheral VRAM/HBM: Measures for gaps between multiple memory and heat sinks ■VRM・MOSFET and other power circuits: Heat dissipation and insulation measures for power circuit components ■SSD and storage peripherals: Heat measures for controllers and NAND, etc. ■Power supply unit and power semiconductors: Heat dissipation measures for high-heat and high-voltage components ■Back of the circuit board, casing, and back plate: Heat transfer and insulation measures to the casing We propose specifications that are processed into shapes suitable for the mounting locations, such as rectangular, irregular shapes, holes, notches, with tabs, and bonded, while also considering assembly and mass production.
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Since our establishment, we have been providing and proposing rapid and accurate packing technologies, regardless of industry or sector. By swiftly strengthening the establishment of a platform revenue base and accommodating various advanced technologies, we have achieved remarkable development. Utilizing indispensable packing technologies, which are often hidden parts of products, we will continue to strive with all our employees to enhance your satisfaction as our motto.
