Aerospace Thermal Dissipation Sheet Processing
Heat dissipation sheet punching processing proposed by Olympic Packing Co., Ltd.
We propose optimal heat dissipation sheet processing for cooling electronic devices in the aerospace field.
In the field of aerospace electronics, the increase in performance has led to a rise in heat generation, making thermal management an important design challenge. Thermal interface materials (TIM) are used to fill the tiny gaps between heat-generating components and heat sinks, efficiently transferring heat to the heat sink or enclosure. At Gorin Packing, we provide a one-stop solution from selecting thermal interface materials based on heat generation, gaps, and usage environments to shaping them according to the installation locations. We offer solutions for thermal challenges in various heat-generating areas such as CPUs, GPUs, VRAM/HBM, VRM/MOSFETs, SSDs, power units, and circuit boards/enclosures. 【Application Scenarios】 - Cooling of high-performance computing devices - Thermal management of space equipment - Temperature control of avionics electronic devices 【Benefits of Implementation】 - Contributes to stable operation of devices - Supports the longevity of components - Enhances reliability
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basic information
【Features】 - Selection of optimal thermal sheets based on application and heat generation conditions - Consideration of thermal conductivity, thickness, hardness/compressibility, electrical insulation, environmental resistance, and reliability - Support for various shape processing such as rectangular and irregular punching, holes and notches, multiple parts, and tabbed processing - Adhesive processing and lamination, as well as half-cut options available - Support for roll supply from prototyping to mass production 【Our Strengths】 Gorin Packing specializes in the punching of soft materials, realizing our customers' "desired shapes" with reliable technology. We support designers with material selection and prototyping suggestions for development. For purchasers, we accommodate small lots to mass production, alleviating concerns about stable procurement and cost. For manufacturers, we contribute to assembly ease and quality improvement with processing precision that considers usability. As a trustworthy partner supporting our customers' manufacturing, we continue to engage in careful craftsmanship.
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■CPU・GPU: Heat transfer between high-heat components and heat sinks ■GPU peripheral VRAM/HBM: Measures for gaps between multiple memory and heat sinks ■VRM, MOSFET, and other power circuits: Heat dissipation and insulation measures for power circuit components ■SSD and storage peripherals: Heat measures for controllers and NAND, etc. ■Power supply unit and power semiconductors: Heat dissipation measures for high-heat and high-voltage components ■Back of the substrate, casing, and backplate: Heat transfer and insulation measures to the casing We propose specifications that are processed into shapes suitable for installation locations, such as rectangular, irregular shapes, holes, notches, tabbed, and laminated, while also considering assembly and mass production.
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Since our establishment, we have been providing and proposing rapid and accurate packing technologies, regardless of industry or sector. By swiftly strengthening the establishment of a platform revenue base and accommodating various advanced technologies, we have achieved remarkable development. Utilizing indispensable packing technologies, which are often hidden parts of products, we will continue to strive with all our employees to enhance your satisfaction as our motto.
