Heat dissipation sheet processing for control panels for industrial equipment.
Heat dissipation sheet punching processing proposed by Olympic Packing Co., Ltd.
We propose processing heat dissipation sheets to solve the thermal issues of control panels.
In industrial equipment control panels, the temperature rise due to heat generation from internal electronic components can lead to malfunctions and reduced lifespan. Particularly in environments that require high-density mounting and continuous operation, efficient heat dissipation measures become crucial. Properly expelling heat from within the control panel and maintaining a stable operating environment are essential for improving the overall reliability of the equipment. Our company supports the resolution of thermal issues by selecting and processing optimal heat dissipation sheets tailored to the heat generation points and the structure of the control panel. 【Usage Scenarios】 - Heat generation points such as CPUs, power units, and motor drive sections within control panels - Improving heat dissipation efficiency in limited spaces - Ensuring stable operation and extending the lifespan of equipment 【Benefits of Implementation】 - Suppression of temperature rise within control panels - Enhanced reliability of electronic components - Stable operation of equipment and reduced maintenance costs
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【Features】 - Selection of heat dissipation sheets according to application and heat generation conditions - Shape processing tailored to the mounting location (square, irregular shapes, holes, notches, etc.) - Supply system capable of supporting everything from prototypes to mass production - Support for secondary processing such as adhesive processing and lamination - Roll supply is also supported, considering integration into automated lines 【Our Strengths】 Gorin Packing specializes in punching soft materials and realizes our customers' "desired shapes" with reliable technology. We flexibly support our customers' manufacturing from material selection assistance at the design stage to small lot and short delivery time responses, as well as mass production. With easy-to-handle processing accuracy, we also contribute to improved assembly efficiency on-site.
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■CPU・GPU: Heat transfer between high-heat components and heat sinks ■GPU peripheral VRAM/HBM: Gap measures between multiple memory and heat sinks ■VRM・MOSFET and other power circuits: Heat dissipation and insulation measures for power circuit components ■SSD and storage peripherals: Heat measures for controllers and NAND, etc. ■Power supply unit and power semiconductors: Heat dissipation measures for high-heat and high-voltage components ■Back of the circuit board, casing, and back plate: Heat transfer and insulation measures to the casing We propose specifications that are processed into shapes suitable for the mounting locations, such as square, irregular shapes, holes, cutouts, with tabs, and laminated, while also considering assembly and mass production.
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Since our establishment, we have been providing and proposing rapid and accurate packing technologies, regardless of industry or sector. By swiftly strengthening the establishment of a platform revenue base and accommodating various advanced technologies, we have achieved remarkable development. Utilizing indispensable packing technologies, which are often hidden parts of products, we will continue to strive with all our employees to enhance your satisfaction as our motto.
