Gaming PC cooling thermal sheet processing for games and entertainment.
Heat dissipation sheet punching processing proposed by Gorin Packing Co., Ltd.
We provide the optimal heat dissipation sheets for gaming PCs in a one-stop solution.
In gaming PCs, as the performance of CPUs and GPUs increases, the amount of heat generated also rises, making thermal management an important design challenge. Thermal interface materials (TIM) fill the tiny gaps between heat-generating components and heat sinks, efficiently transferring heat to the heat sink or chassis. Our Olympic packing service provides a one-stop solution, from selecting the appropriate thermal interface material based on heat generation, gaps, and usage environment, to shaping it to fit the installation locations. 【Usage Scenarios】 - Heat-generating areas of gaming PC CPUs, GPUs, VRAM/HBM, VRM, and MOSFETs - Cooling for SSDs, power units, circuit boards, and chassis - Maintaining performance under high loads 【Benefits of Implementation】 - Suppression of temperature rise in heat-generating components - Improved cooling efficiency for the entire PC - Realization of a stable gaming environment
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basic information
【Features】 - Optimal selection of thermal sheets based on application and heat generation conditions (considering thermal conductivity, thickness, hardness/compressibility, electrical insulation, environmental resistance/reliability, etc.) - Precision shape processing tailored to component shapes and assembly processes (square and irregular cutting, holes and notches, multiple parts processing, tabbed processing, adhesive processing and lamination, half-cutting, etc.) - Supply system capable of supporting from prototyping to mass production (sheet supply, roll supply) - Consistent support from material selection to shape processing and supply form - Extensive track record in punching processing of soft materials 【Our Strengths】 Olympic Packing realizes customers' "desired shapes" with reliable technology, focusing on punching processing of soft materials. We support development by proposing material selection and prototyping to designers, and assist stable procurement with a system capable of handling small lots to mass production for purchasing personnel. For manufacturing, we aim to be a reliable partner that supports customers' manufacturing by providing processing accuracy that contributes to assembly efficiency and quality improvement on-site.
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Applications/Examples of results
■CPU・GPU: Heat transfer between high-heat components and heat sinks ■GPU peripheral VRAM/HBM: Gap measures between multiple memory and heat sinks ■VRM・MOSFET and other power circuits: Heat dissipation and insulation measures for power circuit components ■SSD and storage peripherals: Heat measures for controllers and NAND, etc. ■Power supply unit and power semiconductors: Heat dissipation measures for high-heat and high-voltage components ■Back of the substrate, casing, and backplate: Heat transfer and insulation measures to the casing We propose specifications that are processed into shapes suitable for the mounting locations, considering assembly and mass production.
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Company information
Since our establishment, we have been providing and proposing rapid and accurate packing technologies, regardless of industry or sector. By swiftly strengthening the establishment of a platform revenue base and accommodating various advanced technologies, we have achieved remarkable development. Utilizing indispensable packing technologies, which are often hidden parts of products, we will continue to strive with all our employees to enhance your satisfaction as our motto.
