We will exhibit at "IPF Japan 2026 (International Plastic Fair)," a trade show related to plastic molding and processing, to be held at Makuhari Messe.
At Husky Corporation, we offer a variety of hot runner systems for plastic injection molding, focusing on valve gate types and hot chip types. Additionally, to meet the needs of our Japanese customers, we introduce various hot runner systems tailored to specific applications and molding conditions, including the valve gate hot runner "Ultra Thin," which has been compacted to a minimum shut height of 100mm. At the venue, you can see the latest hot runner systems and technologies. If you have any challenges or requests regarding plastic injection molding, please feel free to consult with us. We sincerely look forward to your visit. 【Exhibition Overview】 ■ Name: IPF Japan 2026 (International Plastic Fair) 11th Edition ■ Dates: December 1 (Tuesday) to December 5 (Saturday), 2026, for 5 days ■ Booth Number: Hall 8, 80101 ■ Opening Hours: 10:00 AM - 5:00 PM (last day until 4:00 PM) ■ Admission Fee: Free for those who register in advance via the internet *For more details, please refer to the related links or feel free to contact us.
Inquire About This Product
basic information
For more details, please refer to the related links or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the related links or feel free to contact us.
catalog（2）
Download All Catalogs
Company information
■ A supplier of the world's largest brand name providing manufacturing solutions, headquartered in Canada ■ Designs and manufactures injection molding machines, hot runners, robots, molds, and integrated systems ■ Manufacturing plants in five locations worldwide and over 40 sales and service locations ■ Hot runner solutions optimize the entire hot runner system, achieving the best gate quality, cavity-to-cavity balance, and rapid color change
![*Forming suitable for mass production [Thermoplastic composites, high-speed stamping molding]*](https://image.mono.ipros.com/public/product/image/d25/2000286823/IPROS88843989283140447640.png?w=280&h=280)
![[Case Studies] Examples of Cooling Improvement and Cycle Reduction through Diffusion Bonding](https://image.mono.ipros.com/public/default/object/noimage_l.gif?w=280&h=280)