Careful work, even if done slowly.
Cutting the sample slowly with low load. This cutting machine minimizes the burden on the sample and emphasizes the quality of the cut surface.
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basic information
Power Supply: 100V or 200-220V Motor: 40W 10-400rpm Grinding Wheel Size: Outer Diameter Φ150 Inner Diameter Φ25.4 (Flange Diameter φ50) Sample Size: MAX φ40mm or □300mm Cutting Load: 0-5N (0-500g) *Excluding the weight of the sample Grinding Wheel Cooling: Water Tank System Safety Mechanism: Equipped with Cover Detection Sensor Dimensions & Weight: W450×D360×H300mm / 25kg
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Applications/Examples of results
Research and development applications for iron-based, non-ferrous, glass, ceramics, resins, and electronic substrates.
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Company information
Since our establishment, we have accumulated technology and know-how as a precision polishing manufacturer in the semiconductor and liquid crystal industries. Leveraging that know-how, we supply precision polishing equipment not only for metal precision polishing but also for semiconductor wafer polishing, compound semiconductor polishing, semiconductor and liquid crystal panel polishing, shaft polishing, sample polishing, and other industries. Being a Japanese product, and specifically made in Wakayama Prefecture, we offer specifications that cater to specific needs. Because we handle design, electrical, materials, manufacturing, and sales all in-house, we can flexibly accommodate custom specifications. In addition, in our control division, we provide maintenance and equipment modifications for existing customer equipment, as well as PLC replacements, utilizing the technology developed through our equipment development. We are dedicated to a customer-first philosophy, striving to improve without being confined to our own designed equipment or specific fields. If you have any polishing concerns, please reach out to IMT first.
