DLAP series for edge AI, equipped with 2nd generation Core 200S/14th generation CPU, capable of supporting PEG graphics cards.
**ADLINK DLAP-4100 Series Features** ■ Width 230 × Height 150 × Depth 300 mm, 10.35 liters ■ 2nd Generation Core 200S / 14th/13th/12th Generation Core i9/i7/i5/13 CPU ■ Memory DDR5 SO-DIMM (up to 64GB) ■ Supports NVIDIA RTX4000 Ada PEG cards ■ Display 2 HDMI, 1 DP ■ I/O Connectors 1 2.5GbE, 1 GbE, 4 USB3.2 (Gen2), 2 USB2.0, 2 COM ■ 1 PCIe [x16] expansion slot
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basic information
Specifications ■CPU: 2nd Generation Core 200S / 14th / 13th / 12th Generation Core i9/i7/i5/13 (TDP: 35W/65W) ■Chipset: Q670 ■Memory: DDR5-4800MHz SODIMM x 2, Maximum 64GB ■PEG Card Support: NVIDIA RTX4000 Ada ■Storage: M.2 M Key, NVMe (2280/2242) x 1, M.2 M Key, NVMe/SATA (2242) x 1, 2.5" HDD/SSD x 2 ■I/O Connectors: 2.5GbE (i226-V) x 1, GbE (i219-LM) x 1, USB3.2 (Gen2) x 4, USB2.0 x 2, RS-232/422/485 x 2, DP 1.4a (DP++) x 1, HDMI 2.0b x 1, HDMI 1.4b x 1, GPIO (8-bit) x 1, Audio Mic in, Line out ■Input Power: AC 100–240V (500W) ■Operating Temperature: -20–60°C ■Dimensions / Weight: 230(W) x 150(H) x 300(D)mm / 7kg
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Applications/Examples of results
In-vehicle multimedia / machine control / factory and building automation / monitoring systems
Line up（5）
| Model number | overview |
|---|---|
| DLAP-4109RF/M32G/1TB | Core i9-14900, 32GB DDR5, 1TB NVMe |
| DLAP-4105RF/M16G/S1TB/RTX4000ADA | Core i5-14500, 16GB DDR5, 1TB SSD, RTX4000Ada |
| DLAP-4107R/M64G/RTX4000ADA | Core i7-13700E, 64GB DDR5, RTX4000Ada |
| DLAP-4107R/M16G/S512GB | Core i7-13700E, 16GB DDR5, 512GB SSD |
| DLAP-4107R/M16G | Core i7-13700E, 16GB DDR5 |
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Company information
Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.