In-house replacement of BGA on prototype boards! Dedicated reballing machine.
BGA Reballing Machine "Jig Station Pro"
Quickly responds to sudden repair requests at the development site. Supports speedy analysis in-house without relying on outsourcing.
■The Dilemma of Sudden Modifications and Outsourcing Arrangements in Prototype Development When a BGA replacement is needed during the testing of a circuit board under development, outsourcing the reballing can result in a time loss of several days, impacting the overall project schedule. ■Compact Design and Easy Operation in the Development Field The space-saving design allows for easy installation in laboratories and development sites. An automatic centering mechanism that accommodates square and rectangular components enables quick setup for a variety of prototype parts. With intuitive slide operations, engineers on-site can perform reballing tasks within the same day. ■A Smooth Development Flow That Does Not Halt Analysis and Evaluation By allowing immediate re-implementation of components without waiting for deliveries from outsourcing partners, the time lost in development can be minimized, enabling the resumption of evaluations promptly.
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basic information
Corresponding ball diameter φ0.25 ~ φ0.76mm Supported package types BGA / LGA / CSP / QFN Supported package size 50mm × 50mm or smaller Supported package thickness 5.0mm or smaller Position accuracy ±0.05mm or smaller Processing time * Approximately 60 seconds per device Input power supply AC 100V 50/60Hz Supply air pressure 0.5MPa External dimensions W556 × D300 × H230mm
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Company information
Toa Electronics Group is pursuing technology and innovation based on its EMS business and wet process business. In the EMS business, we have established a consistent system from planning and development to assembly and manufacturing, providing electronic device-related services with high noise resistance, reliability, and durability. By handling video and content production as well as sound development in-house, we enhance the added value of our products and create unique appeal. In the wet process equipment business, we offer surface treatment equipment and wet process equipment compatible with thin film substrates. Utilizing our unique transport technology to suppress wrinkles, folds, and waviness in substrates, we flexibly accommodate various transport methods (horizontal, vertical, and hoop). We have a proven track record of supporting a wide range of substrates, including flexible substrates, rigid substrates, package substrates, and wafers. We pursue the reliability of electronic devices and innovation in surface treatment technology to support the next generation of manufacturing -- that is Toa Electronics!
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