For high-performance thin films in semiconductors and electronic devices. We propose high-purity W targets tailored to equipment specifications.
Tungsten (W) is a high-performance metal material with a high melting point, excellent heat resistance, and a low thermal expansion coefficient. We propose tungsten sputtering targets as thin film formation materials for semiconductors, electronic components, and various devices. We can discuss purity, dimensions, shapes, and bonding specifications individually, considering applications such as conductive films, electrode films, and barrier films. Contact us at info@wing-eco.com.
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basic information
Material: W Shape: Sputtering target Purity, dimensions, and bonding specifications: Individual confirmation
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Applications/Examples of results
- Semiconductor manufacturing - Electronic components - Electrode film - Conductive film - Thin film formation for research and development
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