Peel! Wash! Dry! All with this one device!
● Anti-double-pick feature! Enables stacking of workpieces, achieving smooth workpiece supply. ● Tact adjustment feature! Recipe settings can be adjusted according to the workpiece. ● One-touch setup change! Automatically performs setup changes suited to the workpiece with just one switch. ● Smooth transportation between processes! The use of dedicated carts for supplying and removing workpieces ensures smooth transport between processes.
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basic information
This is a device for removing and cleaning the remaining chips and tape after chipping, as well as drying them. Adhesives and sticky substances attached to the dicing frame (ring frame, dicing ring, eco ring) can cause contamination. Metal shaved off by the cutter and ring becomes conductive foreign matter... Please use this to improve the yield in the dicing area of the semiconductor manufacturing process.
Price information
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Delivery Time
Applications/Examples of results
Cleaning of the dicing frame
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Company information
Omiya Industrial Co., Ltd. manufactures and sells precision measuring instruments, semiconductor and liquid crystal manufacturing-related equipment, and provides maintenance for rotating machinery. Please feel free to contact us if you have any inquiries.