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  5. Wafer processing/polishing equipment
  6. Takahashi Industrial's dicing frame cleaning device 'TFC Series'

Takahashi Industrial's dicing frame cleaning device 'TFC Series'

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Dicing Frame Cleaning Device "TFC Series"

last updated:Oct 06, 2022

JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
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A device that cleans and removes tape adhesive marks and fingerprints attached to the dicing frame using a unique jet nozzle with high cleaning capability!

The "TFC Series" uses jets to remove tape adhesive and fingerprints attached to the dicing frame used in the wafer cutting (dicing) process. Since there are no contact items like brushes, there is no degradation of cleaning performance due to secondary adhesion of adhesives. ■ Features - Non-contact cleaning mechanism that employs a unique jet nozzle with high cleaning performance → Since it does not use brush cleaning or cloths like wipes, there is no decrease in cleaning power due to clogging or re-adhesion. - Chemical cleaning method using organic solvents - High recovery rate of cleaning solution achieved through a vertical rotating mechanism - Compact size of 1,000mm × 1,500mm × 2,000mm - UV irradiation unit and tape removal unit can be installed (optional) *For more details, please refer to the PDF document or feel free to contact us.

    Wafer processing/polishing equipmentOther semiconductor manufacturing equipmentHigh pressure cleaner
枚葉式ウェット処理装置『TWPシリーズ』.jpg

Takahashi Industrial's dicing frame cleaning device 'TFC Series'

枚葉式ウェット処理装置『TWPシリーズ』.jpg
枚葉式ウェット処理装置『TWPシリーズ』.jpg
  • Special site - Product/service details - https://pr.mono.ipros.com/jfe-shoji-ele/product/

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■Basic Specifications - Material: Dicing ring frame - Size: For standard 6-inch wafers (compatible with various sizes) - Number of processing stations: 1 chamber (expandable) - Scrubbing function: High-pressure jet - Processing liquid: Organic stripping solution; pure water - Chemical supply: Circulation recovery and filtration of chemicals - Processing capacity: 60 wafers/hour - Transport robot: Transport unit - Spin chuck: Mechanical chuck - Transport robot: Scara robot with centering function - Equipment dimensions (WxDxH): 1,000x1,500x2,000mm *For more details, please refer to the PDF document or feel free to contact us.*

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Dicing frame, etc.

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Takeda Industrial's dicing frame cleaning device

Takeda Industrial's dicing frame cleaning device

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JFE商事エレクトロニクス

JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室

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In this department, we provide total solutions for assembly by offering a diverse range of products and high technical capabilities to meet the challenges of our customers, who are globally expanding primarily in China, Thailand, Malaysia, and Vietnam. We focus on excellent assembly equipment from Panasonic Connect (formerly Panasonic Smart Factory Solutions) to support high performance, miniaturization, and lightweight electronics products, as well as peripheral equipment, technical support, and maintenance. Please take a look at our introduction video. https://www.youtube.com/watch?v=efdEd2BVT-A

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The related categories of Wafer processing/polishing equipment

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