Tape remover machine
The tape peeling machine is a device that removes protective films adhered to wafers. Wafers supplied in cassettes are positioned using an aligner, and after tape peeling, they are discharged into the same cassette. ■ Thin Workpiece Compatibility ■ By adopting a unique peeling mechanism and a full-suction table, stress on the wafer is minimized, making it compatible with thin wafers. ■ Retry Function ■ After the peeling operation, a sensor checks for peeling confirmation. If it fails, the peeling operation is reinitiated to prevent any residue. (Number of retries can be set) ■ Alignment Function ■ Before peeling, alignment is performed on the alignment table to match the angle position of the orifice and notch, and to center the wafer, preventing peeling defects due to positional misalignment. ■ Tact Adjustment Function ■ Peeling speed, transport speed, and other parameters can be set via a touch panel, allowing adjustments to suit the workpiece. ■ Tape Empty Detection ■ The remaining amount of peeling tape is detected by a sensor. When the remaining amount reaches 5 meters (modifiable), an alarm notifies the user, eliminating unnecessary machine stops. ■ Static Electricity Countermeasures ■ Equipped with an ionizer (static electricity eliminator) as standard.
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basic information
The tape peeling machine is a device that removes protective film adhered to wafers. Wafers supplied in cassettes are positioned using an aligner, and after tape peeling, they are discharged into the same cassette. ■ Compatible with thin wafers ■ By adopting a unique peeling mechanism and a full-suction table, stress on the wafer is minimized, making it suitable for thin wafers. ■ Retry function ■ After the peeling operation, a sensor checks for peeling confirmation. If it fails, it re-enters the peeling operation to prevent any residue. (Number of retries can be set) ■ Alignment function ■ Before peeling, the alignment table performs angle alignment and centering of the orifice and notch to prevent peeling defects caused by positional misalignment. ■ Tact adjustment function ■ Peeling speed, transport speed, etc., can be set via a touch panel. Adjustments can be made according to the workpiece. ■ Tape empty detection ■ The sensor detects the remaining amount of the peeling tape. When the remaining amount reaches 5m (configurable), an alarm notifies the user, eliminating unnecessary equipment stops. ■ Static electricity countermeasures ■ Equipped with an ionizer (static electricity eliminator) as standard.
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Applications/Examples of results
Peeling off the back grind (BG) tape and other protective tapes after back grinding.
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Company information
Omiya Industrial Co., Ltd. manufactures and sells precision measuring instruments, semiconductor and liquid crystal manufacturing-related equipment, and provides maintenance for rotating machinery. Please feel free to contact us if you have any inquiries.