No cleaning required after soldering.
No-clean type flux that contributes to improving work efficiency during soldering operations.
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basic information
【Features】 □ No cleaning process is required after soldering, allowing for streamlined operations. □ The solder has good flow, making the soldering process comfortable. □ Can also be used as a rust preventive agent for the copper foil surface of printed circuit boards after etching. □ Copper plate corrosion test / no corrosion □ Copper mirror corrosion test / compliant □ Fine copper wire corrosion test / ≤1.5% ● For other functions and details, please download the catalog.
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Applications/Examples of results
【Purpose】 □ To improve work efficiency during soldering tasks □ To enhance solderability of repaired areas □ To protect the copper foil surface until soldering of homemade circuit boards
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