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  6. Semiconductor manufacturing tools: flat rings / dicing rings

Semiconductor manufacturing tools: flat rings / dicing rings

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last updated:Mar 13, 2024

UACJグループ 泉メタル株式会社 
UACJグループ 泉メタル株式会社 
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Complex hollow shapes can also be processed in aluminum.

This is a tool used in the dicing process of silicon wafers, made from aluminum extruded pipes and stainless steel plates (SUS420J2). After plate processing and precision pressing, various surface treatments are applied according to specific requirements, including anodizing, hard anodizing, electroless nickel plating (Kanizen plating), and metal coating. There is no initial cost for basic shapes. We will provide optimal proposals based on your requests, such as "I want to change the inner cutout" or "I want to improve the surface slip properties." For more details, please contact us or refer to the catalog.

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DSZ_5052.JPG

Semiconductor manufacturing tools: flat rings / dicing rings

DSZ_5052.JPG
DSZ_5052.JPG
  • Related Link - https://www.izumi-metal.co.jp/products/product3103…

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basic information

【Features】 ○ Low price, short delivery time, high precision ○ Stainless flat rings available in stock in sizes 5, 6, 8, and 12 inches ○ Used by many semiconductor manufacturers, contributing to cost reduction through mass production ○ Aluminum rings that leverage the characteristics of high-precision aluminum extruded pipes ○ Stainless rings treated for flatness and hardness ○ Advanced processing backed by years of experience ○ Material: SUS420J2 ○ Flatness precision: 0.2mm ○ HRC 50 or higher 【Specifications】 ○ 5” flat ring → Outer diameter φ214, inner diameter φ175 → Thickness: t=1.0 or 1.2 ○ 6” flat ring → Outer diameter φ228, inner diameter φ194 → Thickness: t=1.2 ○ 8” flat ring → Outer diameter φ296, inner diameter φ250 → Thickness: t=1.2 ○ 12” flat ring → Outer diameter φ400, inner diameter φ350 → Thickness: t=1.5 ● For more details, please contact us or refer to the catalog.

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【Achievements】 Currently adopted by approximately 100 semiconductor manufacturers and equipment manufacturers. 【Applications】 Tools used in the dicing process of silicon wafers and for chip transportation. ● For more details, please contact us or refer to the catalog.

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Flat ring / wafer ring

Flat ring / wafer ring

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UACJグループ 泉メタル株式会社 

UACJグループ 泉メタル株式会社 

Ferrous/Non-ferrous metals

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Our company, which is responsible for the trading division of the UACJ Group, was established in October 2003 by integrating and inheriting the businesses of Oba Aluminum Co., Ltd., which has a long history in the non-ferrous metal distribution industry, and Daikin Shoji Co., Ltd. Subsequently, we inherited the businesses of Nakagawa Metal Co., Ltd. in January 2015, Nakata Kinsyo Co., Ltd. in October 2017, and Takano Light Metal Co., Ltd. in October 2018, leading us to the present day.

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