Ultra-vibration flow technology that achieves more than double the speed of conventional plating!!
This is a next-generation plating device with high productivity that transmits vibrations with an output of 20Hz-40Hz to a multi-stage diaphragm equipped with a special mechanism. The ultra-vibrations of the diaphragm create a uniform high-speed turbulent agitation of the liquid in the surface treatment tank, completely resolving the shortcomings of conventional bubble agitation. Additionally, by introducing advanced agitation technology to plating solutions that cannot be agitated by bubbles, it achieves more than double the speed and high-quality plating technology compared to traditional methods, marking a significant leap and advancement in groundbreaking plating technology.
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【Features】 ○ Current density is 4A-6A/dm² (about twice that of conventional methods). ○ In the case of printed circuit boards, the standard deviation (σ) of the plating thickness is 1.4-1.5. ○ Glossiness is superior to that achieved by foam agitation. ○ For through-hole substrates, the electrowetting within the holes improves (throwing power over 85%). ○ No burning or charring occurs at points of current concentration, even at high current densities. ○ The de-foaming effect is outstanding, resulting in very few pit defects caused by gas accumulation. ○ The combination of micro-aeration and ultrasonic flow technology significantly improves electrowetting uniformity. ● For more details, please contact us or download the catalog.
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Used for copper sulfate plating, nickel plating, chrome plating, zinc plating, alloy plating, solder plating, tin plating, gold plating, silver plating, Joule nickel plating, composite plating, etc.
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