Germany's ERSA company offers a simple and compact high-performance rework system.
The unique hybrid heating method of ERSA allows for the benefits of mid-infrared heating to be maintained while enabling safe and easy rework of lead-free small SMD components on a tabletop. There is no scattering of the target components or adjacent components, which was a drawback of traditional blower methods, allowing for efficient heating of the substrate and components, and enabling work with minimal delta t. The ERSA HR100 not only allows for handheld heating like traditional blowers but also demonstrates its potential as a full-fledged rework system when combined with a bottom heater. Additionally, it can be connected via USB cable to the control software IRSoft for the ERSA rework system, enabling advanced system setups such as profile control and temperature measurement and management. The ERSA HR200 is a machine designed to be easy and safe for anyone to use, with operations and functions minimized. Its compact and lightweight body does not require specific installation locations or usage environments, making it highly effective in a wide range of settings.
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basic information
The unique hybrid heating method of ERSA allows for the benefits of mid-infrared heating to be maintained while enabling safe and easy rework of lead-free small SMD components on a tabletop. There is no scattering of the target components or adjacent components, which was a drawback of the traditional blower method, allowing for efficient heating of the substrate and components, and enabling work with minimal delta t. The ERSA HR100 not only allows for handheld heating like traditional blowers but also demonstrates its potential as a full-fledged rework system when combined with a bottom heater. Additionally, it can be connected via USB to the control software IRSoft for the ERSA rework system, enabling advanced system configurations such as profile control and temperature measurement and management. The ERSA HR200 is a machine designed to be easy and safe for anyone to use, with operations and functions minimized. Its compact and lightweight body does not require specific installation locations or environmental conditions, making it highly effective in a wide range of settings.
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Applications/Examples of results
Removal and mounting of small lead-free surface mount components (BGA, QFN, QFP, SOIC, microchip capacitors, resin connectors, sockets, etc.), as well as various through-hole mounted components. In addition to the above, we have received many implementations for applications such as BGA removal and mounting on mobile phone circuit boards and automotive circuit boards that are difficult to remove from their housings.
Line up（2）
| Model number | overview |
|---|---|
| ERSA HR100 | Thanks to ERSA's unique hybrid infrared heater technology, even small handheld tools achieve high heating efficiency. It is ideal for reworking small high-mass components that are difficult to rework with a hand blower. |
| ERSA HR200 | This latest model is equipped with ERSA's proprietary hybrid infrared heater and minimizes operations/functions. There is no issue with component displacement caused by hot air blowing. |
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Company information
We have demonstration units of ERSA products on display at our Kashiwa showroom. Customers who are interested are welcome to visit us. We are also actively participating in various exhibitions, so we hope you will stop by when you attend. For detailed product information and business content, please refer to our company website. https://www.dynatechplus.co.jp
![[Work Example] WLCSP Rework](https://image.mono.ipros.com/public/product/image/773/2001492309/IPROS43933751246315225995.png?w=280&h=280)
![[Exchange/Installation/Removal] High-quality BGA rework](https://image.mono.ipros.com/public/product/image/957/2000712715/IPROS66007723340493538286.png?w=280&h=280)
