Contract Services Using Ion Milling Equipment | JTL
Equipment > Contract services using ion milling apparatus
In mechanical polishing, structures that cannot be observed due to crushing are beautifully finished.
An ion milling device is a cross-section polishing apparatus that performs polishing and etching for observation and analysis by irradiating the surface of a sample with a very weak argon ion beam. In conventional mechanical polishing, soft materials such as copper and aluminum can suffer from surface flattening and sagging, while hard materials like ceramics and silicon can experience cracking and fractures. However, the ion milling device resolves these issues, allowing for a clean and undamaged observation surface. The ion milling device is suitable for sample preparation for high-magnification observation and analysis in micro-regions, enabling the production of cross-sectional samples for sub-micron order observation, EDX/WDX analysis, crystal state observation, and crystal orientation analysis (EBSD).
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basic information
【Polishing of hard and soft materials is possible】 - In conventional mechanical polishing, hard materials often suffer from edge rounding or chipping, while soft materials may leave polishing scratches, which can hinder the observation of the inspected area. However, this device can achieve a clean polished surface regardless of the material type. 【Observation of the crystalline state of metallic materials is possible】 - When observing the crystals of metallic materials, chemical etching is typically performed to reveal the metal structure. However, thanks to the argon ion etching capability of this device, it is possible to prepare cross-sectional samples for observing the crystalline state and analyzing crystal orientation. 【High-magnification observation/analysis of thin films, multilayer films, and alloy layers is possible】 - It is possible to achieve a polished surface finish that can withstand high-magnification (up to about 100,000 times) observation and analysis of thin films, multilayer films, and alloy layers, which is challenging with conventional mechanical polishing. - The load on the sample is very low, resulting in a polished surface with minimal rounding, making it suitable for observing voids and cracks at interfaces. 【Samples embedded in cups can also be adjusted (manufactured by Sanyu Electronics: SVM-730)】 - Larger samples can be adjusted in the spacious chamber area. - Samples polished with embedding resin can also be accommodated with planar ion milling.
Price information
Prices may vary depending on the observation and analysis content, so please feel free to contact us.
Delivery Time
※The delivery date may vary depending on the content of the observation and analysis, so please feel free to contact us.
Applications/Examples of results
- Observation of voids and cracks in solder cross-sections - High-magnification observation of alloy layers (plating and solder) - Cross-sectional observation, component analysis, and mapping of alloy layers - Non-destructive observation of voids and volume calculation in aluminum castings - Component analysis and material identification (material type determination) of steel and aluminum alloys - Observation and measurement of melting amount in welded joints - Observation of metal flow in metallic materials - Observation of the crystalline state of metallic materials and pre-treatment polishing for EBSP - Investigation of plating film thickness using non-destructive (X-ray) methods
Company information
Our main business is providing technical services to evaluate the reliability of developed products. We not only provide evaluation data in accordance with standards and regulations, but also propose optimal methods, conditions, and equipment for evaluation purposes, as well as design and manufacture original equipment and jigs for non-standard evaluations. Additionally, we handle three evaluation techniques—measurement, testing, and analysis—comprehensively, allowing us to offer complex services that span diverse equipment and suggest more multifaceted evaluation methods.
